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M40SZ100W Schematic ( PDF Datasheet ) - STMicroelectronics

Teilenummer M40SZ100W
Beschreibung NVRAM supervisor
Hersteller STMicroelectronics
Logo STMicroelectronics Logo 




Gesamt 20 Seiten
M40SZ100W Datasheet, Funktion
M40SZ100W
3 V NVRAM supervisor for LPSRAM
16
1
SO16
Features
Convert low power SRAMs into NVRAMs
3 V operating voltage
Precision power monitoring and power
switching circuitry
Automatic write-protection when VCC is out-of-
tolerance
Choice of supply voltage and power-fail
deselect voltage:
– VCC = 2.7 to 3.6 V; 2.55 V VPFD 2.70 V
Reset output (RST) for power on reset
1.25 V reference (for PFI/PFO)
Less than 15 ns chip enable access
propagation delay
Battery low pin (BL)
RoHS compliant
– Lead-free second level interconnect
Datasheet - production data
Description
The M40SZ100W NVRAM controller is a self-
contained device which converts a standard low-
power SRAM into a non-volatile memory. A
precision voltage reference and comparator
monitors the VCC input for an out-of-tolerance
condition.
When an invalid VCC condition occurs, the
conditioned chip enable output (ECON) is forced
inactive to write protect the stored data in the
SRAM. During a power failure, the SRAM is
switched from the VCC pin to the external battery
to provide the energy required for data retention.
On a subsequent power-up, the SRAM remains
write-protected until a valid power condition
returns.
December 2013
This is information on a product in full production.
DocID007528 Rev 4
1/20
www.st.com






M40SZ100W Datasheet, Funktion
Device overview
VCC
VBAT
RSTIN
E
PFI
1.25V
1. Open drain output
Figure 2. Pin connections
NC
NC
RST
NC
RSTIN
PFO
VBAT
VSS
1 16
2 15
3 14
4 M40SZ100W 13
5 12
6 11
7 10
89
VCC
NC
VOUT
NC
PFI
BL
E
ECON
Figure 3. Block diagram
VBL= 2.5V COMPARE
VSO = 2.5V COMPARE
VPFD= 2.65V COMPARE
POR
COMPARE
M40SZ100W
AI03935
VOUT
BL (1)
RST(1)
ECON
PFO
AI04766
6/20 DocID007528 Rev 4

6 Page









M40SZ100W pdf, datenblatt
Operation
M40SZ100W
If a battery low is generated during a power-up sequence, this indicates that the battery is
below 2.5 V and may not be able to maintain data integrity in the SRAM. Data should be
considered suspect, and verified as correct. A fresh battery should be installed.
If a battery low indication is generated during the 24-hour interval check, this indicates that
the battery is near end of life. However, data is not compromised due to the fact that a
nominal VCC is supplied. In order to insure data integrity during subsequent periods of
battery back-up mode, the battery should be replaced.
The M40SZ100W only monitors the battery when a nominal VCC is applied to the device.
Thus applications which require extensive durations in the battery backup mode should be
powered-up periodically (at least once every few months) in order for this technique to be
beneficial. Additionally, if a battery low is indicated, data integrity should be verified upon
power-up via a checksum or other technique. The BL pin is an open drain output and an
appropriate pull-up resistor to VCC should be chosen to control the rise time.
2.5 Power-fail input/output
The power-fail input (PFI) is compared to an internal reference voltage (independent from
the VPFD comparator). If PFI is less than the power-fail threshold (VPFI), the power-fail
output (PFO) will go low. This function is intended for use as an undervoltage detector to
signal a failing power supply. Typically PFI is connected through an external voltage divider
(see Figure 4 on page 7) to either the unregulated DC input (if it is available) or the
regulated output of the VCC regulator. The voltage divider can be set up such that the
voltage at PFI falls below VPFI several milliseconds before the regulated VCC input to the
M40SZ100W or the microprocessor drops below the minimum operating voltage.
During battery backup, the power-fail comparator turns off and PFO goes (or remains) low.
This occurs after VCC drops below VPFD(min). When power returns, PFO is forced high,
irrespective of VPFI for the write protect time (tREC), which is the time from VPFD (max) until
the inputs are recognized. At the end of this time, the power-fail comparator is enabled and
PFO follows PFI. If the comparator is unused, PFI should be connected to VSS and PFO left
unconnected.
2.6 VCC noise and negative going transients
ICC transients, including those produced by output switching, can produce voltage
fluctuations, resulting in spikes on the VCC bus. These transients can be reduced if
capacitors are used to store energy which stabilizes the VCC bus. The energy stored in the
bypass capacitors will be released as low going spikes are generated or energy will be
absorbed when overshoots occur. A ceramic bypass capacitor value of 0.1 μF (as shown in
Figure 8 on page 13) is recommended in order to provide the needed filtering.
In addition to transients that are caused by normal SRAM operation, power cycling can
generate negative voltage spikes on VCC that drive it to values below VSS by as much as
one volt. These negative spikes can cause data corruption in the SRAM while in battery
backup mode. To protect from these voltage spikes, STMicroelectronics recommends
connecting a Schottky diode from VCC to VSS (cathode connected to VCC, anode to VSS).
Schottky diode 1N5817 is recommended for through hole and MBRS120T3 is
recommended for surface mount.
12/20
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