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XD1001-BD Schematic ( PDF Datasheet ) - MA-COM

Teilenummer XD1001-BD
Beschreibung Distributed Amplifier
Hersteller MA-COM
Logo MA-COM Logo 




Gesamt 8 Seiten
XD1001-BD Datasheet, Funktion
XD1001-BD
Distributed Amplifier
18-50 GHz
Features
Ultra Wide Band Driver Amplifier
Fiber Optic Modulator Driver
17.0 dB Small Signal Gain
5.0 dB Noise Figure
30 dB Gain Control
+15.0 dBm P1dB Compression Point
100% On-Wafer RF, DC and Output Power
Testing
100% Visual Inspection to MIL-STD-883 Method
2010
RoHS* Compliant and 260°C Reflow Compatible
Description
M/A-COM Tech’s 18.0-50.0 GHz GaAs MMIC
distributed amplifier has a small signal gain of 17.0
dB with a noise figure of 5.0 dB across the band.
The device also includes 30.0 dB gain control and a
+15 dBm P1dB compression point. This MMIC uses
M/A-COM Tech’s GaAs PHEMT device model
technology, and is based upon electron beam
lithography to ensure high repeatability and
uniformity. The chip has surface passivation to
protect and provide a rugged part with backside via
holes and gold metallization to allow either a
conductive epoxy or eutectic solder die attach
process. This device is well suited for microwave,
millimeter-wave and wideband military applications.
Ordering Information
Part Number
Package
XD1001-BD-000V
V” - vacuum release gel
paks
XD1001-BD-EV1
evaluation module
Chip Device Layout
Rev. V1
Absolute Maximum Ratings
Parameter
Absolute Max.
Supply Voltage (Vd)
Supply Current (Id)
Gate Bias Voltage (Vg)
Input Power (Pin)
Storage Temperature (Tstg)
Operating Temperature (Ta)
Channel Temperature (Tch)1
+6.0 VDC
220 mA
+0.3 V
+15 dBm
-65 ºC to +165 ºC
-55 ºC to +85 ºC
+175 ºC
(1) Channel temperature affects a device's MTTF. It is recommended to
keep channel temperature as low as possible for maximum life.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
India Tel: +91.80.43537383
China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.






XD1001-BD Datasheet, Funktion
XD1001-BD
Distributed Amplifier
18-50 GHz
Mechanical Drawing
1.300
(0.051)
0.396
(0.016)
2
3
0.922
(0.036)
Rev. V1
0.379
(0.015)
1
0.0 4
0.0 1.555 1.950
(0.061) (0.077)
(Note: Engineering designator is 30DA0445)
Units:millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness:0.110 +/- 0.010 (0.0043 +/- 0.0004),Backside is ground,Bond Pad/Backside Metallization:Gold
All DCBond Pads are 0.100 x 0.100 (0.004 x 0.004).All RFBond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance:+/- 0.005 (+/- 0.0002).Approximate weight:1.572 mg.
Bond Pad #1 (RFIn)
Bond Pad #2 (Vd)
Bias Arrangement
Vd
Bond Pad #3 (RFOut)
Bond Pad #4 (Vg)
Bypass Capacitors - See App Note [2]
Vd
2
3 RF Out
RF In 1
RFIn
4
Vg
XD1001-BD
RFOut
Vg
6
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
India Tel: +91.80.43537383
China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.

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