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UM3202 Schematic ( PDF Datasheet ) - Union Semiconductor

Teilenummer UM3202
Beschreibung 2-Bit Bidirectional Voltage-Level Translator
Hersteller Union Semiconductor
Logo Union Semiconductor Logo 




Gesamt 13 Seiten
UM3202 Datasheet, Funktion
UM3202
2-Bit Bidirectional Voltage-Level Translator for Open-Drain and
Push-Pull Application
UM3202Q DFN8 1.70×1.35
UM3202A QFN10 1.80×1.40
UM3202H CSP8 1.90×0.90
General Description
The UM3202Q/3202A/3202H is ±15kV dual channel ESD-protected level translator provide the
level shifting necessary to allow data transfer in a multi-voltage system. Externally applied
voltages, VCCB and VCCA, set the logic levels on either side of the device. A low-voltage logic
signal present on the VCCA side of the device appears as a high-voltage logic signal on the VCCB
side of the device, and vice-versa. The UM3202Q/3202A/3202H bidirectional level translator
utilizes a transmission-gate based design to allow data translation in either direction (VCCAVCCB)
on any single data line. The UM3202Q/3202A/3202H accepts VCCA from +1.65V to +3.6V and
VCCB from +2.3V to +5.5V, making it ideal for data transfer between low-voltage ASICs / PLDs
and higher voltage systems.
The UM3202Q/3202A/3202H enters a three-state output mode to reduce supply current when
output enable (OE) is low. The UM3202Q/3202A/3202H is designed so that the OE input circuit
is supplied by VCCA. ±15kV ESD protection on the VCCB side for greater protection in applications
that route signals externally.
The UM3202Q is a dual level translator available in DFN8 1.70×1.35, the UM3202A is a dual
level translator available in QFN10 1.80×1.40, and the UM3202H is a dual level translator
available in CSP8 1.90×0.90 package.
Applications
Features
SPI, MICROWIRE, and I2C Level Max Data Rates:
Translation
24Mbps(Push Pull),
Low-Voltage ASIC Level Translation
2Mbps(Open Drain)
Smart Card Readers
Bidirectional Level Translation
Cell-phone Cradles
1.65V to 3.6V on A port and 2.3V to 5.5V
Portable POS Systems
Portable Communication Devices
on B port (VCCAVCCB)
±15kV ESD Protection on B port
Low-Cost Serial Interfaces
No Power-Supply Sequencing Required
Cell-Phones
GPS
VCCA or VCCB Can Be Ramped First
DFN8, QFN10 and CSP8 Packages
Telecommunications Equipment
________________________________________________________________________
http://www.union-ic.com Rev.06 Sep.2013
1/13






UM3202 Datasheet, Funktion
UM3202
Switching Characteristics
Over recommended operating free-air temperature range, VCCA= 2.5V±0.2V (unless otherwise noted)
Parameter
From
(Input)
To
(Output)
Test
Conditions
VCCB=2.5V
±0.2V
Min Max
VCCB=3.3V
±0.3V
Min Max
VCCB=5V
±0.5V
Min Max
Unit
tPHL
A
tPLH
Push-pull
3.2 3.3
3.4
B
Open-drain 1.7 6.3 2
Push-pull
3.5
6 2.1
4.1
5.8
4.4
ns
Open-drain 43 250 36 206 27
190
tPHL
B
tPLH
Push-pull
3 3.6
4.3
A
Open-drain 1.8
Push-pull
4.7 2.6
2.5
4.2 1.2
1.6
4
0.7
ns
Open-drain 44 170 37 140 27
103
ten OE
A
B
200 200
200 200
200
200
ns
tdis OE
A
B
50 40
50 40
35
35
ns
trA
A port rise time
Push-pull 2.8 7.4 2.6 6.6 1.8
Open-drain 34 149 28 121 24
5.6
89
ns
trB
B port rise time
Push-pull 3.2 8.3 2.9 7.2 2.4
Open-drain 35 151 24 112 12
6.1
64
ns
tfA
A port fall time
Push-pull 1.9
Open-drain 4.4
5.7 1.9
6.9 4.3
5.5 1.8
6.2 4.2
5.3
5.8
ns
tfB
B port fall time
Push-pull 2.2
Open-drain 5.1
7.8 2.4
8.8 5.4
6.7 2.6
9.4 5.4
6.6
10.4
ns
tSK(O) Channel-to-channel
Max data
Push-pull 24
1
24
1
24
1 ns
rate
Open-drain 2
2
2
Mbps
________________________________________________________________________
http://www.union-ic.com Rev.06 Sep.2013
6/13

6 Page









UM3202 pdf, datenblatt
UM3202
Package Information
UM3202H: CSP8 1.90X0.90
Outline Drawing
E
Ball 1
Index Aera
E1
C
Top View
Bottom View
Side View
Symbol
A
A1
D
E
D1
E1
e
b
C
L
DIMENSIONS
Millimeters
Inch
Min Max
Min
Max
0.65 0.026
0.21 0.24 0.008
0.010
1.85 1.95 0.074
0.078
0.85 0.95 0.034
0.038
1.50BSC
0.06BSC
0.50BSC
0.020BSC
0.50BSC
0.02BSC
0.27 0.32 0.011
0.013
0.25BSC
0.01BSC
0.25BSC
0.01BSC
Land Pattern
Tape and Reel Orientation
NOTES:
1. Bump is Lead Free Sn/Ag/Cu.
2. Unit: mm;
3. Non-solder mask defined copper landing pad.
4. Laser Mark on silicon die back; back-lapped.
________________________________________________________________________
http://www.union-ic.com Rev.06 Sep.2013
12/13

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