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PDF F59D4G81A Data sheet ( Hoja de datos )

Número de pieza F59D4G81A
Descripción 4 Gbit (512M x 8 / 256M x 16) 1.8V NAND Flash Memory
Fabricantes Elite Semiconductor 
Logotipo Elite Semiconductor Logotipo



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No Preview Available ! F59D4G81A Hoja de datos, Descripción, Manual

ESMT
Flash
FEATURES
Voltage Supply: 1.8V (1.7V ~ 1.95V)
Organization
x8:
- Memory Cell Array: (512M + 8M) x 8bit
- Data Register: (2K + 64) x 8bit
x16:
- Memory Cell Array: (256M + 4M) x 16bit
- Data Register: (1K + 32) x 16bit
Automatic Program and Erase
x8:
- Page Program: (2K + 64) Byte
- Block Erase: (128K + 4K) Byte
x16:
- Page Program: (1K + 32) Word
- Block Erase: (64K + 2K) Word
Page Read Operation
- Page Size: (2K + 64) Byte (x8)
Page Size: (1K + 32) Word (x16)
- Random Read: 25us (Max.)
- Serial Access: 45ns (Min.)
Memory Cell: 1bit/Memory Cell
Fast Write Cycle Time
- Program time: 350us (Typ.)
- Block Erase time: 3.5ms (Typ.)
F59D4G81A / F59D4G161A
4 Gbit (512M x 8 / 256M x 16)
1.8V NAND Flash Memory
Command/Address/Data Multiplexed I/O Port
Hardware Data Protection
- Program/Erase Lockout During Power Transitions
Reliable CMOS Floating Gate Technology
- ECC Requirement: x8 - 4bit/512Byte
x16 - 4bit/256Word
- Endurance: 100K Program/Erase cycles
- Data Retention: 10 years
Command Register Operation
Automatic Page 0 Read at Power-Up Option
- Boot from NAND support
- Automatic Memory Download
NOP: 4 cycles
Cache Program/Read Operation
Copy-Back Operation
Two-Plane Operation
EDO mode
Bad-Block-Protect
ORDERING INFORMATION
Product ID
Speed
Package
x8:
F59D4G81A -45TG
45 ns
48 pin TSOPI
x16:
F59D4G161A -45TG 45 ns
48 pin TSOPI
Comments
Pb-free
Pb-free
GENERAL DESCRIPTION
The device is a 512Mx8bit with spare 16Mx8bit capacity (or
256Mx16bit with spare 8Mx16bit capacity). The device is offered
in 1.8V VCC Power Supply. Its NAND cell provides the most
cost-effective solution for the solid state mass storage market.
The memory is divided into blocks that can be erased
independently so it is possible to preserve valid data while old
data is erased.
The device contains 4096 blocks, composed by 64 pages
consisting in two NAND structures of 32 series connected Flash
cells. A program operation allows to write the 1056-Word page in
typical 350us and an erase operation can be performed in typical
3.5ms on a 128K-Byte for X8 device block (or 64K-Word for X16
device block).
Data in the page mode can be read out at 45ns cycle time per
Elite Semiconductor Memory Technology Inc.
Word. The I/O pins serve as the ports for address and command
inputs as well as data input/output. The copy back function
allows the optimization of defective blocks management: when a
page program operation fails the data can be directly
programmed in another page inside the same array section
without the time consuming serial data insertion phase. The
cache program feature allows the data insertion in the cache
register while the data register is copied into the Flash array.
This pipelined program operation improves the program
throughput when long files are written inside the memory. A
cache read feature is also implemented. This feature allows to
dramatically improving the read throughput when consecutive
pages have to be streamed out. This device includes extra
feature: Automatic Read at Power Up.
Publication Date: May 2014
Revision: 1.4
1/54

1 page




F59D4G81A pdf
ESMT
BLOCK DIAGRAM (x16)
F59D4G81A / F59D4G161A
ARRAY ORGANIZATION (x16)
Array Address (x16)
I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 I/O8~I/O15
Address
1st cycle A0 A1 A2 A3 A4 A5 A6 A7
L* Column Address
2nd cycle A8 A9 A10 L* L* L* L* L*
L* Column Address
3rd cycle
A11 A12 A13 A14 A15 A16 A17 A18
L*
Row Address
4th cycle
5th cycle
A19 A20 A21 A22 A23 A24 A25 A26
A27 A28
L*
L*
L*
L*
L*
L*
L*
L*
Row Address
Row Address
NOTE:
Column Address: Starting Address of the Register.
* L must be set to “Low”.
* The device ignores any additional input of address cycles than required.
A17 is for Plane Address setting.
Elite Semiconductor Memory Technology Inc.
Publication Date: May 2014
Revision: 1.4
5/54

5 Page





F59D4G81A arduino
ESMT
F59D4G81A / F59D4G161A
NAND Flash Technical Notes
Mask Out Initial Invalid Block(s)
Initial invalid blocks are defined as blocks that contain one or more initial invalid bits whose reliability is not guaranteed by ESMT. The
information regarding the initial invalid block(s) is called the initial invalid block information. Devices with initial invalid block(s) have the
same quality level as devices with all valid blocks and have the same AC and DC characteristics. An initial invalid block(s) does not
affect the performance of valid block(s) because it is isolated from the bit line and the common source line by a select transistor. The
system design must be able to mask out the initial invalid block(s) via address mapping.
The 1st block, which is placed on 00h block address, is guaranteed to be a valid block up to 1K program/erase cycles with 4bit/512Byte
(4bit/256Word) ECC.
Identifying Initial Invalid Block(s) and Block Replacement Management
All device locations are erased (FFh) except locations where the initial invalid block(s) information is written prior to shipping. The initial
invalid block(s) status is defined by the 1st byte in the spare area. ESMT makes sure that either the 1st or 2nd page of every initial
invalid block has non-FFh data at the 1st byte column address in the spare area.
Do not erase or program factory-marked bad blocks. The host controller must be able to recognize the initial invalid block information
and to create a corresponding table to manage block replacement upon erase or program error when additional invalid blocks develop
with Flash memory usage.
Elite Semiconductor Memory Technology Inc.
Publication Date: May 2014
Revision: 1.4
11/54

11 Page







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