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Teilenummer | HSMS-2818 |
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Beschreibung | Surface Mount RF Schottky Barrier Diodes | |
Hersteller | AVAGO | |
Logo | ||
Gesamt 10 Seiten HSMS-281x
Surface Mount RF Schottky Barrier Diodes
Data Sheet
Description/Applications
These Schottky diodes are specifically designed for both
analog and digital applications. This series offers a wide
range of specifications and package configurations to
give the designer wide flexibility. The HSMS‑281x series of
diodes features very low flicker (1/f ) noise.
Note that Avago’s manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent
sites on the wafer, assuring the highest degree of match.
Features
• Surface Mount Packages
• Low Flicker Noise
• Low FIT (Failure in Time) Rate*
• Six-sigma Quality Level
• Single, Dual and Quad Versions
• Tape and Reel Options Available
• Lead-free
• For more information see the Surface Mount Schottky
Reliability Data Sheet.
Pin Connections and Package Marking
16
25
34
Notes:
1. Package marking provides orientation and identification.
2. See “Electrical Specifications” for appropriate package marking.
Package Lead Code Identification, SOT-323
(Top View)
SINGLE
SERIES
Package Lead Code Identification, SOT-23/SOT-143
(Top View)
SINGLE
3
SERIES
3
COMMON
ANODE
3
COMMON
CATHODE
3
1 #0 2
UNCONNECTED
PAIR
34
1 #2 2
RING
QUAD
34
12
#3
BRIDGE
QUAD
34
1 #4 2
1 #5 2
1 #7 2
1 #8 2
Package Lead Code Identification, SOT-363
(Top View)
HIGH ISOLATION
UNCONNECTED PAIR
654
UNCONNECTED
TRIO
654
B
COMMON
ANODE
C
COMMON
CATHODE
EF
123
K
COMMON
CATHODE QUAD
654
123
L
COMMON
ANODE QUAD
654
1 2M 3
BRIDGE
QUAD
654
1 2N 3
RING
QUAD
654
123
123
SMT Assembly
Reliable assembly of surface mount components is a com‑
plex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reflow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT package, will reach solder reflow temperatures faster
than those with a greater mass.
Avago’s SOT diodes have been qualified to the time-tem‑
perature profile shown in Figure 8. This profile is repre‑
sentative of an IR reflow type of surface mount assembly
process.
After ramping up from room temperature, the circuit
board with components attached to it (held in place with
solder paste) passes through one or more preheat zones.
The preheat zones increase the temperature of the board
and components to prevent thermal shock and begin
evaporating solvents from the solder paste. The reflow
zone briefly elevates the temperature sufficiently to pro‑
duce a reflow of the solder.
The rates of change of temperature for the ramp-up and
cool-down zones are chosen to be low enough to not
cause deformation of the board or damage to compo‑
nents due to thermal shock. The maximum temperature
in the reflow zone (TMAX) should not exceed 260°C.
These parameters are typical for a surface mount assem‑
bly process for Avago diodes. As a general guideline, the
circuit board and components should be exposed only
to the minimum temperatures and times necessary to
achieve a uniform reflow of solder.
Tp
T L Ts max
Ramp-up
tp
tL
Critical Zone
T L to Tp
Ts min
ts
Preheat
Ramp-down
25
t 25° C to Peak
Figure 8. Surface Mount Assembly Profile.
Time
Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)
Reflow Parameter
Average ramp-up rate (Liquidus Temperature (TS(max) to Peak)
Preheat
Temperature Min (TS(min))
Temperature Max (TS(max))
Time (min to max) (tS)
Ts(max) to TL Ramp-up Rate
Time maintained above:
Peak Temperature (TP)
Time within 5 °C of actual Peak temperature (tP)
Ramp-down Rate
Temperature (TL)
Time (tL)
Time 25 °C to Peak Temperature
Note 1: All temperatures refer to topside of the package, measured on the package body surface
Lead-Free Assembly
3°C/ second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
260 +0/-5°C
20-40 seconds
6°C/second max
8 minutes max
6 Page | ||
Seiten | Gesamt 10 Seiten | |
PDF Download | [ HSMS-2818 Schematic.PDF ] |
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