Datenblatt-pdf.com


HSMS-280E Schematic ( PDF Datasheet ) - AVAGO

Teilenummer HSMS-280E
Beschreibung Surface Mount RF Schottky Barrier Diodes
Hersteller AVAGO
Logo AVAGO Logo 




Gesamt 10 Seiten
HSMS-280E Datasheet, Funktion
HSMS-280x
Surface Mount RF Schottky Barrier Diodes
Data Sheet
Description/Applications
These Schottky diodes are specifically designed for both
analog and digital applications. This series offers a wide
range of specifications and package configurations to
give the designer wide flexibility. The HSMS-280x series
of diodes is optimized for high voltage applications.
Note that Avago’s manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent sites
on the wafer, assuring the highest degree of match.
Features
x Surface Mount Packages
x High Breakdown Voltage
x Low FIT (Failure in Time) Rate*
x Six-sigma Quality Level
x Single, Dual and Quad Versions
x Tape and Reel Options Available
x Lead-free
* For more information see the Surface Mount Schottky Reliability
Data Sheet.
Package Lead Code Identification, SOT-323 (Top View)
SINGLE
SERIES
Package Lead Code Identification, SOT-363 (Top View)
HIGH ISOLATION
UNCONNECTED PAIR
654
UNCONNECTED
TRIO
654
B
COMMON
ANODE
E
C
COMMON
CATHODE
F
Package Lead Code Identification, SOT-23/SOT-143 (Top View)
SINGLE
3
SERIES
3
COMMON
ANODE
3
COMMON
CATHODE
3
123
K
COMMON
CATHODE QUAD
654
123
M
BRIDGE
QUAD
654
123
P
123
L
COMMON
ANODE QUAD
654
123
N
RING
QUAD
654
123
R
12
#0
UNCONNECTED
PAIR
34
12
#2
BRIDGE
QUAD
34
12
#3
12
#4
1 #5 2
1 #8 2






HSMS-280E Datasheet, Funktion
SMT Assembly
Reliable assembly of surface mount components is a
complex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reflow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT package, will reach solder reflow temperatures faster
than those with a greater mass.
Avago’s SOT diodes have been qualified to the time-
temperature profile shown in Figure 8. This profile is
representative of an IR reflow type of surface mount as-
sembly process.
After ramping up from room temperature, the circuit
board with components attached to it (held in place
with solder paste) passes through one or more preheat
zones. The preheat zones increase the temperature of the
board and components to prevent thermal shock and
begin evaporating solvents from the solder paste. The
reflow zone briefly elevates the temperature sufficiently
to produce a reflow of the solder.
The rates of change of temperature for the ramp-up and
cool-down zones are chosen to be low enough to not
cause deformation of the board or damage to compo-
nents due to thermal shock. The maximum temperature
in the reflow zone (TMAX) should not exceed 260°C.
These parameters are typical for a surface mount assem-
bly process for Avago diodes. As a general guideline, the
circuit board and components should be exposed only
to the minimum temperatures and times necessary to
achieve a uniform reflow of solder.
Tp
TL
Ts max
Ramp-up
tp
tL
Critical Zone
T L to Tp
Ts min
ts
Preheat
Ramp-down
25
t 25° C to Peak
Time
Figure 8. Surface Mount Assembly Profile.
Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)
Reflow Parameter
Average ramp-up rate (Liquidus Temperature (TS(max) to Peak)
Preheat
Temperature Min (TS(min))
Temperature Max (TS(max))
Time (min to max) (tS)
Ts(max) to TL Ramp-up Rate
Time maintained above:
Peak Temperature (TP)
Time within 5 °C of actual Peak temperature (tP)
Ramp-down Rate
Temperature (TL)
Time (tL)
Time 25 °C to Peak Temperature
Note 1: All temperatures refer to topside of the package, measured on the package body surface
6
Lead-Free Assembly
3°C/ second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
260 +0/-5°C
20-40 seconds
6°C/second max
8 minutes max

6 Page







SeitenGesamt 10 Seiten
PDF Download[ HSMS-280E Schematic.PDF ]

Link teilen




Besondere Datenblatt

TeilenummerBeschreibungHersteller
HSMS-2800Surface Mount RF Schottky Barrier DiodesAgilent Technologies
Agilent Technologies
HSMS-2800Surface Mount RF Schottky Barrier DiodesAVAGO
AVAGO
HSMS-2802Surface Mount RF Schottky Barrier DiodesAgilent Technologies
Agilent Technologies
HSMS-2802Surface Mount RF Schottky Barrier DiodesAVAGO
AVAGO
HSMS-2803Surface Mount RF Schottky Barrier DiodesAgilent Technologies
Agilent Technologies

TeilenummerBeschreibungHersteller
CD40175BC

Hex D-Type Flip-Flop / Quad D-Type Flip-Flop.

Fairchild Semiconductor
Fairchild Semiconductor
KTD1146

EPITAXIAL PLANAR NPN TRANSISTOR.

KEC
KEC


www.Datenblatt-PDF.com       |      2020       |      Kontakt     |      Suche