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G5258 Schematic ( PDF Datasheet ) - Global Mixed-mode Technology

Teilenummer G5258
Beschreibung Dual Power Distribution Switch
Hersteller Global Mixed-mode Technology
Logo Global Mixed-mode Technology Logo 




Gesamt 1 Seiten
G5258 Datasheet, Funktion
Global Mixed-mode Technology Inc.
G5258
Dual Power Distribution Switch
Features
„ 87mΩ High-Side MOSFET
„ Available with 4 Versions of Current Limits with
Foldback
„ Operating Range:2.7V to 5.5V
„ 400µS Typical Rise Time
„ Under voltage Lockout
„ 65µA Quiescent Supply Current
„ 1µA Maximum Shutdown Supply Current
„ Logic Level Enable Pin, Available with
Active-High or Active-Low Version
„ No Reverse Current to VIN when Power Off
„ VOUT OFF Discharge
„ Deglitched Open-Drain Over-Current Flag
Output ( OC )
„ SOP-8 Package and TDFN3X3-8 Package
„ UL Approved_#E232223
„ Nemko IEC 60950-1 CB/CCA_scheme certifica-
tion Report #67291
„ CSA Approved #230321
General Description
The G5258 is an integrated dual channel 87mΩ power
switch for self-powered and bus-powered Universal
Serial Bus (USB) applications.
Several Protection features include current limiting
with foldback, and thermal shutdown to prevent catas-
trophic switch failure caused by increasing power dis-
sipation when continuous heavy loads or short circuit
occurs. And a built-in charge pump is used to drive the
N-channel MOSFET that is free of parasitic body diode
to eliminate any reversed current flow across the
switch when it is powered off.
OC is open-drain output report over-current or
over-temperature event and has typical 9ms deglitch
timeout period.
Applications
„ High-Side Power Protection Switch
„ USB Power Management
„ USB Host and Self-Powered Bubs
„ USB Bus-Powered Hubs
„ Hot Plug-In Power Supplies
„ Battery-Charger Circuits
Pin Configuration
G5258
GND 1
IN 2
EN1(EN1) 3
EN2 (EN2) 4
SOP-8
G5258
8 OC1
7 OUT1
6 OUT2
5 OC2
GND 1
IN 2
EN1(EN1) 3
EN2 (EN2) 4
Thermal
Pad
8 OC1
7 OUT1
6 OUT2
5 OC2
Typical Application Circuit
Power Supply
2.7V to 5.5V
IN OUT1
1µF
OC1
EN1 (EN1)
OC2
OUT2
EN2 (EN2)
0.1µF
Load
22µF
0.1µF
Load
22µF
TDFN3X3-8
Note: Recommend connecting the Thermal Pad to the GND for excellent power dissipation.
R
UL Recognized Component
Ver 1.6
Apr 12, 2011
TEL: 886-3-5788833
http://www.gmt.com.tw
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