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SBAS40-04LT1G Schematic ( PDF Datasheet ) - ON Semiconductor
| Teilenummer | SBAS40-04LT1G |
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| Beschreibung | Dual Series Schottky Barrier Diode | |
| Hersteller | ON Semiconductor | |
| Logo |  |
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Gesamt 3 Seiten 
BAS40-04LT1G,
SBAS40-04LT1G
Dual Series
Schottky Barrier Diode
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is excellent for hand held and portable applications where
space is limited.
Features
Extremely Fast Switching Speed
Low Forward Voltage
AEC Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Reverse Voltage
Forward Power Dissipation
@ TA = 25C
Derate above 25C
VR 40
V
PF
225 mW
1.8 mW/C
Operating Junction and Storage
Temperature Range
TJ, Tstg
−55 to +150
C
Forward Continuous Current
Single Forward Current
tv1s
t v 10 ms
IFM
IFSM
120
200
600
mA
mA
Thermal Resistance (Note 1)
Junction−to−Ambient (Note 2)
RqJA
508
311
C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ minimum pad.
2. FR−4 @ 1.0 x 1.0 in pad.
http://onsemi.com
40 VOLTS
SCHOTTKY BARRIER DIODES
SOT−23 (TO−236)
CASE 318
STYLE 11
ANODE
1
CATHODE
2
3
CATHODE/ANODE
MARKING DIAGRAM
CB MG
G
1
CB = Specific Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
BAS40−04LT1G
SBAS40−04LT1G
SOT−23
(Pb−Free)
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 11
1
Publication Order Number:
BAS40−04LT1/D
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| Seiten | Gesamt 3 Seiten | |
| PDF Download | [ SBAS40-04LT1G Schematic.PDF ] | |
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