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PDF PH5504A2NA1 Data sheet ( Hoja de datos )
| Número de pieza | PH5504A2NA1 | |
| Descripción | Ambient Light Sensor | |
| Fabricantes | Renesas | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de PH5504A2NA1 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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A Business Partner of Renesas Electronics Corporation.
PH5504A2NA1
Ambient Light Sensor
Data Sheet
R08DS0067EJ0100
Rev.1.00
Nov 05, 2012
DESCRIPTION
The PH5504A2NA1 is an ambient light sensor with a photo diode and current amplifier. This product has spectral
characteristics close to human eye sensitivity and outputs light current proportional to the ambient brightness.
The PH5504A2NA1 can be used to improve the performance and reduce the power consumption of digital equipment
such as FPD-TV sets and mobile phones, by enabling automatic brightness control and automatic switching on and off
of lighting systems.
FEATURES
• Small and thin SON package
2.55 x 1.56 x 0.55 mm
• Spectral characteristics close to human eye sensitivity
Peak sensitivity wavelength
530 nm TYP.
• The impact of infrared light can be reduced by incorporating infrared light correction circuits.
• Output characteristics proportional to illuminance
• Output light current
55 μA TYP.@100 lx (Fluorescent light)
• Reduced variation of output current among light sources
• Low voltage operation
• Pb-free
VCC = 1.8 to 5.5 V
APPLICATIONS
• FPD TV sets, displays
• Mobile phones, smartphones
• Notebook PCs, tablet PCs
• DSCs, DVCs
• FA equipment
• Lighting systems, etc.
R08DS0067EJ0100 Rev.1.00
Nov 05, 2012
Page 1 of 11
1 page  
PH5504A2NA1
*4 Switching Time
Pulse input
VCC
VCC
PH5504A
GND
OUT
RL
Input
Output
td
tr
*5 White LED
ts
tf
90%
10%
A Business Partner of Renesas Electronics Corporation.
Chapter Title
R08DS0067EJ0100 Rev.1.00
Nov 05, 2012
Page 5 of 11
5 Page 
PH5504A2NA1
NOTES ON HANDLING
A Business Partner of Renesas Electronics Corporation.
Chapter Title
1. Recommended reflow soldering conditions
(including infrared reflow, convection reflow, and infrared + convection reflow)
(1) This product is dry-packed with desiccant in order to avoid moisture absorption.
(2) After breaking the seal, reflow soldering must be done within 168 hours under the recommended temperature
profile shown below.
(3) If more than 168 hours have passed after breaking the seal, the baking process must be done by using a tape and
reel.
Baking conditions: Once, with tape and reel, 60±5°C, 10 to 24 hours
After the baking process, this product must be stored under conditions of 30°C or below, 70% RH or below, and
reflow soldering must be done within 168 hours.
< Storage conditions after breaking seal >
• Storage conditions
• Maximum storage period after breaking seal
: 30°C or below, 70% RH or below
: 168 hours (Second reflow soldering must be completed
within 168 hours.)
< Reflow soldering conditions >
• Peak reflow temperature
• Maximum number of reflows
• No repair by hand soldering
• Maximum chlorine content of rosin flux (percentage mass)
: 260°C or below (Package surface temperature)
:2
: 0.2% or less
Recommended Temperature Profile of Reflow
Ramp-up rate 3°C/s MAX.
Peak Temperature
260°C MAX.
255°C
220°C
200°C
Ramp-down rate 6°C/s MAX.
150°C
60 to 120 s
30 s or less
60 s or less
Time
8 min. MAX.
R08DS0067EJ0100 Rev.1.00
Nov 05, 2012
Page 11 of 11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet PH5504A2NA1.PDF ] | |
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