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ULN2003APG Schematic ( PDF Datasheet ) - Toshiba Semiconductor

Teilenummer ULN2003APG
Beschreibung 7ch Darlington Sink Driver
Hersteller Toshiba Semiconductor
Logo Toshiba Semiconductor Logo 




Gesamt 13 Seiten
ULN2003APG Datasheet, Funktion
ULN2003,04APG/AFWG
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
ULN2003APG,ULN2003AFWG
ULN2004APG,ULN2004AFWG
7-ch Darlington Sink Driver
The ULN2003APG/AFWG Series are highvoltage, highcurrent
darlington drivers comprised of seven NPN darlington pairs.
All units feature integral clamp diodes for switching inductive
loads.
Applications include relay, hammer, lamp and display (LED)
drivers.
Features
z Output current (single output): 500 mA max
z High sustaining voltage output: 50 V min
z Output clamp diodes
z Inputs compatible with various types of logic
z Package Type-APG: DIP-16pin
z Package Type-AFWG: SOL-16pin
ULN2003APG
ULN2004APG
ULN2003AFWG
ULN2004AFWG
Type
ULN2003APG/AFWG
ULN2004APG/AFWG
Input Base
Resistor
2.7 kΩ
10.5 kΩ
Designation
TTL, 5 V CMOS
6 to 15 V PMOS, CMOS
Weight
DIP16P-300-2.54A : 1.11 g (typ.)
SOL16P-150-1.27A: 0.15 g (typ.)
Pin Connection (top view)
1 2010-12-03






ULN2003APG Datasheet, Funktion
8. tON, tOFF
ULN2003,04APG/AFWG
Note 1: Pulse width 50 μs, duty cycle 10%
Output impedance 50 Ω, tr 5 ns, tf 10 ns
Note 2: See below
Input Condition
Type Number
R1
ULN2003A
ULN2004A
0
0
Note 3: CL includes probe and jig capacitance.
VIH
3V
8V
Precautions for Using
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed
due to shortcircuit between outputs, air contamination fault, or fault by improper grounding.
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6 Page









ULN2003APG pdf, datenblatt
ULN2003,04APG/AFWG
Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into
consideration in system design.
About solderability, following conditions were confirmed
Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
12
2010-12-03

12 Page





SeitenGesamt 13 Seiten
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