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PDF MPX2100AP Data sheet ( Hoja de datos )

Número de pieza MPX2100AP
Descripción 100 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors
Fabricantes Freescale Semiconductor 
Logotipo Freescale Semiconductor Logotipo



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No Preview Available ! MPX2100AP Hoja de datos, Descripción, Manual

Freescale Semiconductor
+ 100 kPa On-Chip Temperature
Compensated and Calibrated
Silicon Pressure Sensors
The MPX2100 series devices silicon piezoresistive pressure sensors
providing a highly accurate and linear voltage output directly proportional to
the applied pressure. The sensor is a single, monolithic silicon diaphragm
with the strain gauge and a thin-film resistor network integrated on-chip.
The chip is laser trimmed for precise span and offset calibration an
temperature compensation.
Features
• Temperature Compensated Over 0°C to +85°C
• Available in Absolute, Differential and Gauge Configurations
• Easy to Use Chip Carrier Package Options
• Ratiometric to Supply Voltage
±0.25% Linearity (MPX2100D Series)
Pressure
MPX2100
Rev 10, 10/2008
MPX2100
Series
0 to 100 kPa (0 to 14.5 psi)
40 mV Full Scale Span
(Typical)
Application Examples
• Pump/Motor Controllers
• Robotics
• Level Indicators
• Medical Diagnostics
• Pressure Switching
• Barometers
Device Name
Package
Options
Case
No.
Unibody Package (MPX2100 Series)
MPX2100A
Tray
344
MPX2100D
Tray
344
MPX2100AP
Tray
344B
MPX2100GP
Tray
344B
MPX2100DP
Tray
344C
MPX2100GVP
Tray
344D
MPX2100ASX
Tray
344F
ORDERING INFORMATION
# of Ports
Pressure Type
None Single
Dual
Gauge Differential Absolute
Device
Marking
MPX2100A
MPX2100D
MPX2100AP
MPX2100GP
MPX2100DP
MPX2100GVP
MPX2100A
PACKAGES
MPX2100A/D
CASE 344-15
MPX2100AP/GP
CASE 344B-01
MPX2100DP
CASE 344C-01
MPX2100GVP
CASE 344D-01
MPX2100ASX
CASE 344F-01
© Freescale Semiconductor, Inc., 2002, 2008. All rights reserved.

1 page




MPX2100AP pdf
On-Chip Temperature Compensation and Calibration
Pressure
Figure 3 shows the output characteristics of the
MPX2100 series at 25°C. The output is directly proportional
to the differential pressure and is essentially a straight line.
The effects of temperature on Full-Scale Span and Offset
are very small and are shown under Operating
Characteristics.
40
35
30
25
20
15
10
5
0
-5
kPa 0
PSI
VS = 10 Vdc
TA = 25°C
P1 > P2
MAX
25
3.62
TYP
MIN
50
7.25
75
10.87
Span
Range
(Typ)
Offset
100 (Typ)
14.5
Figure 3. Output versus Pressure Differential
Silicone Gel
Die Coat
Wire Bond
Differential/Gauge
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Silicone Gel
Die Coat
Wire Bond
Absolute
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Lead Frame
Differential/Gauge Element
P2
Bond Lead Frame
Die
Absolute Element
P2
Die
Bond
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2100 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Sensors
Freescale Semiconductor
MPX2100
5

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