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PDF MCP37210-200 Data sheet ( Hoja de datos )
| Número de pieza | MCP37210-200 | |
| Descripción | 12-Bit Low-Power Single-Channel ADC | |
| Fabricantes | Microchip Technology | |
| Logotipo |  |
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MCP37210-200
MCP37D10-200
200 Msps, 12-Bit Low-Power Single-Channel ADC
Features
• Sample Rates: 200 Msps
• Signal-to-Noise Ratio (SNR) with fIN = 15 MHz
and -1 dBFS:
- 67 dBFS (typical) at 200 Msps
• Spurious-Free Dynamic Range (SFDR) with
fIN = 15 MHz and -1 dBFS:
- 96 dBc (typical) at 200 Msps
• Power Dissipation with LVDS Digital I/O:
- 338 mW at 200 Msps
• Power Dissipation with CMOS Digital I/O:
- 306 mW at 200 Msps, output clock = 100 MHz
• Power Dissipation Excluding Digital I/O:
- 257 mW at 200 Msps
• Power-Saving Modes:
- 80 mW during Standby
- 33 mW during Shutdown
• Supply Voltage:
- Digital Section: 1.2V, 1.8V
- Analog Section: 1.2V, 1.8V
• Selectable Full-Scale Input Range: up to 1.8 VP-P
• Analog Input Bandwidth: 650 MHz
• Output Interface:
- Parallel CMOS, DDR LVDS
• Output Data Format:
- Two's complement or offset binary
• Optional Output Data Randomizer
Device Offering(1)
• Digital Signal Post-Processing (DSPP) Options:
- Decimation filters for improved SNR
- Offset and Gain adjustment
- Noise-Shaping Requantizer (NSR)
- Digital Down-Conversion (DDC) with I/Q or
fS/8 output (MCP37D10-200)
• Built-In ADC Linearity Calibration Algorithms:
- Harmonic Distortion Correction (HDC)
- DAC Noise Cancellation (DNC)
- Dynamic Element Matching (DEM)
- Flash Error Calibration
• Serial Peripheral Interface (SPI)
• Package Options:
- VTLA-124 (9 mm x 9 mm x 0.9 mm)
- TFBGA-121 (8 mm x 8 mm x 1.08 mm)
• No external reference decoupling capacitor
required for TFBGA Package
• Industrial Temperature Range: –40°C to +85°C
Typical Applications
• Communication Instruments
• Microwave Digital Radio
• Cellular Base Stations
• Radar
• Scanners and Low-Power Portable Instruments
• Industrial and Consumer Data Acquisition System
Part Number
Sample Rate
Resolution
Digital Decimation
Digital
(FIR Filters) Down-Conversion
Noise-Shaping
Requantizer
MCP37210-200
200 Msps
12
Yes
No
Yes
MCP37D10-200
200 Msps
12
Yes
Yes
Yes
MCP37220-200
200 Msps
14
Yes
No
No
MCP37D20-200
200 Msps
14
Yes
Yes
No
Note 1: For TFBGA package, contact Microchip Technology Inc. for availability. Devices in the same package type
are pin-compatible.
2015 Microchip Technology Inc.
DS20005395A-page 1
1 page  
MCP37210-200 AND MCP37D10-200
1.0 PACKAGE PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Top View
(Not to Scale)
NC
AVDD18 AIN- AVDD12
NC AVDD12 VBG REF- REF+ AVDD12 VCM SCLK SDIO
NC
A68 A67 A66 A65 A64 A63 A62 A61 A60 A59 A58 A57 A56 A55 A54 A53 A52 A51
A1
A2
A3
A4
NC
A5
A6
A7
A8
A9
NC A10
A11
A12
A13
A14
A15
A16
B56 B55 B54 B53 B52 B51 B50 B49 B48 B47 B46 B45 B44 B43 B42
Note 2
AIN+
AVDD18 Note 2
SENSE REF- REF+
CS DVDD18
B1 AVDD18
B41
B2
B3
B4
B5
B6 Note 2
B7
B8
VTLA-124
(9 mm x 9 mm x 0.9 mm)
EP
(GND)
Note 4
B40
DVDD12 B39
WCK/OVR+
(OVR)
B38
Q11/Q5+ B37
DVDD18 B36
Q8/Q4- B35
Q6/Q3- B34
B9 Q5/Q2+ B33
B10 Q3/Q1+ B32
B11
AVDD12
B12
DVDD18 B31
Q0/Q0- B30
B13
B14
AVDD12
B15 B16
CLK-
B17
Note 1
ADR0 SYNC
B18 B19
GND RESET DCLK+
DVDD18
B20 B21 B22 B23 B24
B25
B29
DVDD18
B26 B27 B28
A50
Note 2
A49
A48
A47
A46
A45 WCK/OVR-
(WCK)
A44 Q10/Q5-
A43 Q9/Q4+
A42 Q7/Q3+
A41 DVDD18
A40 Q4/Q2-
A39 Q2/Q1-
A38 Q1/Q0+
A37
A36
A35
A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 A32 A33 A34
NC Note 2
CLK+ AVDD18 SLAVE
DVDD12 CAL DCLK- TP Note 3 DVDD12
NC Note 2
Note 1: Tie to GND or DVDD18. ADR1 is internally bonded to GND.
2: NC – Not connected pin. This pin can float or be tied to ground.
3: TP – Test pin. Leave this pin floating and do not tie to ground or supply.
4: Exposed pad (EP – back pad of the package) is the common ground (GND) for analog and digital
supplies. Connect this pad to a clean ground reference on the PCB.
FIGURE 1-1:
VTLA-124 Package.
2015 Microchip Technology Inc.
DS20005395A-page 5
5 Page 
MCP37210-200 AND MCP37D10-200
TABLE 1-2: PIN FUNCTION TABLE FOR TFBGA-121 (CONTINUED)
Ball No. Name
I/O Type
Description
D3 GND
Supply Common ground for analog and digital sections
D4
D5 AVDD12
D6
Supply Supply voltage input (1.2V) for analog section
D7
D8 GND
Supply Common ground for analog and digital sections
D9
D10
D11
E1 Q8/Q4-
E2 Q9/Q4+
Digital
Output
Digital data output(3)
CMOS = Q8
DDR LVDS = Q4-
Digital data output(3)
CMOS = Q9
DDR LVDS = Q4+
E3 GND
Supply Common ground for analog and digital sections
E4
E5 AVDD12
E6
Supply voltage input (1.2V) for analog section
E7
E8 GND
Common ground for analog and digital sections
E9
E10
E11
F1 Q6/Q3-
F2 Q7/Q3+
Digital
Output
Digital data output(3)
CMOS = Q6
DDR LVDS = Q3-
Digital data output(3)
CMOS = Q7
DDR LVDS = Q3+
F3 DVDD18
F4
Supply
Supply voltage input (1.8V) for digital section.
All digital input pins are driven by the same DVDD18 potential.
F5 AVDD12
F6
Supply voltage input (1.2V) for analog section
F7
F8 GND
Common ground for analog and digital sections
F9
F10
F11
G1 Q4/Q2- Digital Output Digital data output(3)
CMOS = Q4
DDR LVDS = Q2-
G2 Q5/Q2+
Digital data output(3)
CMOS = Q5
DDR LVDS = Q2+
2015 Microchip Technology Inc.
DS20005395A-page 11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet MCP37210-200.PDF ] | |
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