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PDF MPX2050GP Data sheet ( Hoja de datos )
| Número de pieza | MPX2050GP | |
| Descripción | 50 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors | |
| Fabricantes | Freescale Semiconductor | |
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Pressure
Freescale Semiconductor
MPX2050
Rev 9, 10/2008
+ 50 kPa On-Chip Temperature
Compensated and Calibrated
Silicon Pressure Sensors
The MPX2050 series devices are silicon piezoresistive pressure sensors
providing a highly accurate and linear voltage output, directly proportional to the
applied pressure. The sensor is a single, monolithic silicon diaphragm with the
strain gauge and a thin-film resistor network integrated on-chip. The chip is laser
trimmed for precise span and offset calibration and temperature compensation.
Features
• Temperature Compensated Over 0°C to +85°C
• Unique Silicon Shear Stress Strain Gauge
• Easy to Use Chip Carrier Package Options
• Ratiometric to Supply Voltage
• Differential and Gauge Options
• ±0.25% Linearity
MPX2050
Series
0 to 50 kPa (0 to 7.25 psi)
40 mV Full Scale Span
(Typical)
Application Examples
• Pump/Motor Controllers
• Robotics
• Level Indicators
• Medical Diagnostics
• Pressure Switching
• Non-Invasive Blood Pressure
Device Name
Package
Options
Case
No.
Unibody Package (MPX2050 Series)
MPX2050D
Tray
344
MPX2050GP
Tray
344B
MPX2050DP
Tray
344C
MPX2050GSX Tray
344F
None
•
ORDERING INFORMATION
# of Ports
Single
Dual
Gauge
Pressure Type
Differential Absolute
Device Marking
•
•
•
•
•
•
•
MPX2050D
MPX2050GP
MPX2050DP
MPX2050D
PACKAGES
MPX2050D
CASE 344-15
MPX2050GP
CASE 344B-01
MPX2050DP
CASE 344C-01
MPX2050GSX
CASE 344F-01
© Freescale Semiconductor, Inc., 2002, 2008. All rights reserved.
1 page  
On-Chip Temperature Compensation and Calibration
Pressure
Figure 3 shows the minimum, maximum and typical output
characteristics of the MPX2050 series at 25°C. The output is
directly proportional to the differential pressure and is
essentially a straight line.
The effects of temperature on Full-Scale Span and Offset
are very small and are shown under Operating
Characteristics.
40
35
30
25
20
15
10
5
0
-5
kPa 0
PSI
VS = 10 Vdc
TA = 25°C
MPX2050
P1 > P2
MAX
12.5
1.8
TYP
MIN
25
3.6
37.5
5.4
Span
Range
(Typ)
Offset
50 (Typ)
7.25
Figure 3. Output versus Pressure Differential
Silicone
Die Coat
Wire Bond
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Lead Frame
P2
RTV Die
Bond
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344). A silicone gel isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPX2050 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Sensors
Freescale Semiconductor
MPX2050
5
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet MPX2050GP.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| MPX2050GP | 50 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors | Freescale Semiconductor |
| MPX2050GSX | 50 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors | Freescale Semiconductor |
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