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MPX5700GP Schematic ( PDF Datasheet ) - Freescale Semiconductor

Teilenummer MPX5700GP
Beschreibung Integrated Silicon Pressure Sensor
Hersteller Freescale Semiconductor
Logo Freescale Semiconductor Logo 




Gesamt 10 Seiten
MPX5700GP Datasheet, Funktion
Freescale Semiconductor
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPX5700 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Available in Absolute, Differential and Gauge Configurations
• Patented Silicon Shear Stress Strain Gauge
• Durable Epoxy Unibody Element
Pressure
MPX5700
Rev 9, 09/2009
MPX5700
Series
0 to 700 kPa (0 to 101.5 psi)
15 to 700 kPa (2.18 to 101.5 psi)
0.2 to 4.7 V Output
Device Name
Case
No.
Unibody Package (MPX5700 Series)
MPX5700A
MPX5700AP
MPX5700AS
867
867B
867E
MPX5700ASX
MPX5700D
MPX5700DP
MPX5700GP
MPX5700GP1
MPX5700GS
867F
867
867C
867B
867B
867E
None
ORDERING INFORMATION
# of Ports
Single
Dual
Gauge
Pressure Type
Differential Absolute
Device
Name
• • MPX5700A
• • MPX5700AP
• • MPX5700A
• • MPX5700A
• • MPX5700D
• • MPX5700DP
••
MPX5700GP
••
MPX5700GP
••
MPX5700D
UNIBODY PACKAGES
MPX5700A/D
CASE 867-08
MPX5700AP/GP/GP1
CASE 867B-04
MPX5700DP
CASE 867C-05
MPX5700AS/GS
CASE 867E-03
MPX5700ASX
CASE 867F-03
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.






MPX5700GP Datasheet, Funktion
Pressure
PACKAGE DIMENSIONS
C
B
J
S
M
-A-
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER
POSITIVE PRESSURE
(P1)
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
PIN 1
SEATING
PLANE
-T-
1 2 3 45 6
N
L
G
F
D 6 PL
0.136 (0.005) M T A M
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.595 0.630 15.11 16.00
B 0.514 0.534 13.06 13.56
C 0.200 0.220 5.08 5.59
D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
G 0.100 BSC
2.54 BSC
J 0.014 0.016 0.36 0.40
L 0.695 0.725 17.65 18.42
M 30˚ NOM
30˚ NOM
N 0.475 0.495 12.07 12.57
R 0.430 0.450 10.92 11.43
S 0.090 0.105 2.29 2.66
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
CASE 867-08
ISSUE N
BASIC ELEMENT
PORT #1
POSITIVE
PRESSURE
(P1)
PORT #2
VACUUM
(P2)
SEATING
PLANE
-T-
P
0.25 (0.010) M T Q M
X
R
N
B
C
-T-
SEATING
PLANE
J
PIN 1
-A-
U
WL
V
1 2 34 5 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
-Q-
K
S
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.405 0.435 10.29 11.05
D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
G 0.100 BSC
2.54 BSC
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.063 0.083 1.60 2.11
S 0.220 0.240 5.59 6.10
U 0.910 BSC
23.11 BSC
V 0.182 0.194 4.62 4.93
W 0.310 0.330 7.87 8.38
X 0.248 0.278 6.30 7.06
G
F
D 6 PL
0.13 (0.005) M A M
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
CASE 867C-05
ISSUE F
PRESSURE AND VACUUM SIDES PORTED (DP)
MPX5700
6
Sensors
Freescale Semiconductor

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