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PDF MPXS4100A Data sheet ( Hoja de datos )
| Número de pieza | MPXS4100A | |
| Descripción | INTEGRATED PRESSURE SENSOR | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MPXS4100A (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MPXS4100A/D
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The Motorola MPXS4100A series Barometric Absolute Pressure (BAP) sensor for
engine control is designed to sense absolute air pressure.
Motorola’s BAP sensor integrates on–chip, bipolar op amp circuitry and thin film
resistor networks to provide a high output signal and temperature compensation. The
small form factor and high reliability of on–chip integration make the Motorola BAP
sensor a logical and economical choice for the automotive system designer.
Features
• 1.8% Maximum Error Over 0° to 85°C
• Surface Mount Package
• Available Tape and Reeled or in Sleeves
• Ideally Suited for Direct Microprocessor Interfacing
• Patented Silicon Shear Stress Strain Gauge
• Temperature Compensated Over – 40 to +125°C
• Ideal for Non–automotive applications
• Also Available in Unibody Package (see MPX4100A/D data sheet)
Application
• Barometric Absolute Pressure for Engine Control
VS
2
X–ducer
SENSING
ELEMENT
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
4
Vout
MPSXESR4I1E0S0A
INTEGRATED
PRESSURE SENSOR
20 to 105 kPa (2.9 to 15.2 psi)
0.3 to 4.9 V OUTPUT
BASIC CHIP CARRIER
ELEMENT
CASE 471–01, STYLE 1
PIN NUMBER
1 N/C 5 N/C
2 VS 6 N/C
3 Gnd 7 N/C
4 Vout 8 N/C
NOTE: Pins 1, 5, 6, 7 and 8 are
internal device connections. Do not
connect to external circuitry or
ground.
3 PINS 1 AND 5 THROUGH 8 ARE NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
MAXIMUM RATINGS(1)
Rating
Overpressure(2)
Burst Pressure(2)
Symbol
Pmax
Pburst
Value
400
1000
Unit
kPa
kPa
Storage Temperature
Tstg
– 40 to +125
°C
Operating Temperature
TA
– 40 to +125
°C
1. TC = 25°C unless otherwise noted.
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Senseon and X–ducer are trademarks of Motorola, Inc.
REV 1
©MMoottoororolal,aInSc.e1n9s97or Device Data
1
1 page  
MPXS4100A SERIES
INFORMATION FOR USING THE SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
pad geometry, the packages will self align when subjected to
a solder reflow process.
0.835
0.100 TYP
0.060 TYP 8X
NOT TO SCALE
0.300
0.080 TYP 8X
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of this device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device damage and/or failure.
Therefore, the following items should always be observed in
order to minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and soldering
zones should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case, including the port, must not exceed
the maximum temperature ratings as shown on the data
sheet. When using infrared heating with the reflow
soldering method, the difference between the leads and
the case shall be a maximum of 10°C.
• Wave soldering is not recommended for the pressure
sensor surface mount package due to the exposure of
the die to the environment.
• The soldering temperature and time shall not exceed
240°C for more than 5 seconds.
• When shifting from preheating to soldering zones, the
maximum temperature gradient or rise rate shall be
2°C/second or less.
• After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used since the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied during
cooling.
• Recommend usage of a no–clean solder paste to avoid
circuit board cleaning.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
Motorola Sensor Device Data
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MPXS4100A.PDF ] | |
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