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SST11CP22 Schematic ( PDF Datasheet ) - Microchip

Teilenummer SST11CP22
Beschreibung 5.1-5.9 GHz High-Power 11ac WLAN Power Amplifier
Hersteller Microchip
Logo Microchip Logo 




Gesamt 18 Seiten
SST11CP22 Datasheet, Funktion
SST11CP22
5.1-5.9 GHz High-Power 11ac WLAN Power Amplifier
Features
• Small package size
- 20-contact UQFN (4mm x 4mm x 0.6 mm max)
• 50input and output match including DC blocks
• Integrated harmonic filter
• Operating voltage
- VCC = 5.0V
• Operating frequency: 5.1 to 5.9 GHz
• High linear output power, typical performance:
- 802.11a OFDM Spectrum mask compliant up
to 24 dBm
- 802.11n HT40 OFDM Spectrum mask compliant
up to 23.5 dBm
- 3% EVM up to 20.5 dBm for 802.11a, 54 Mbps
signal
- 2.5% EVM up to 20 dBm for 802.11n, HT40
- 1.8% EVM up to 19 dBm for 802.11ac, MCS9,
80 MHz BW (bandwidth) signal
• High power-added efficiency/low operating cur-
rent for 54 Mbps 802.11a applications
- ~11% @ POUT = 24 dBm for 802.11a OFDM
• Gain:
- Typically 31 dB gain across 5.1–5.9 GHz
• Idle current
- ~290 mA ICQ
• High-speed power-up/down
- Turn on/off time (10%-90%) <100 ns
• Shut-down current (~2 µA)
• On-chip power detection
- 20 dB linear dynamic range
- VSWR insensitive
• All devices are RoHS compliant
Applications
• WLAN (IEEE 802.11a/n/ac)
• HyperLAN2
• Multimedia
Product Description
SST11CP22 is a 50, RF-matched power amplifier
module (PAM) with a FCC-compliant harmonic filter
that is based on the highly-reliable InGaP/GaAs HBT
technology.
Operating over the 5.1–5.9 GHz frequency band,
SST11CP22 meets 802.11a spectrum mask require-
ments up to 24 dBm and 802.11n HT40 spectrum mask
at 23.5 dBm. With 802.11a modulation, this PA typically
provides up to 20.5 dBm with 3% EVM, and provides
19 dBM with less tan 1.8% dynamic EVM using
802.11ac modulation, MCS9, 80 MHz bandwidth.
This power amplifier module also features easy board-level
operation, with a simple application circuit requiring only four
external components. With its high-speed power-up/-down
control and low enable control current of less than 3 mA,
SST11CP22 is controllable directly from the baseband chip.
SST11CP22 also features a wide dynamic-range, linear
power detector that is temperature-stable and VSWR-
insensitive.
SST11CP22 is offered in 20-contact QFN package. See
Figure 2-1 for pin assignments and Table 2-1 for pin
descriptions.
2013 Microchip Technology Inc.
Preliminary
DS70005126A-page 1






SST11CP22 Datasheet, Funktion
SST11CP22
TABLE 3-3:
AC ELECTRICAL CHARACTERISTICS FOR CONFIGURATION VCC = 5.0V,
VPEN=2.95V
Symbol
Parameter
Min. Typ Max.
Unit
FL-U Frequency range
5.1 5.9 GHz
Output power at 3% EVM at 54 Mbps OFDM signal,
20.5
dBm
802.11a
Output power at 2.5% dynamic EVM 802.11n HT40
20
dBm
Linear
Power
Output power 1.8% dynamic EVM MCS9 80 MHz
BW
ACPRA output power level with 802.11a mask com-
pliance @ 6Mbps OFDM
19
24
dBm
dBm
ACPRN40 output power level with 802.11n HT40
mask compliance
23.5 dBm
G Power gain from 5.18-5.9 GHz
31 dB
RF Input Small signal
Return Loss
10 dB
0
Second
Harmonic
Power Den-
sity
Harmonics at 24 dBm
-45 dBm/MHz
0
Third
Harmonic
Power Den-
sity
Harmonics at 24 dBm
-50 dBm/MHz
DS70005126A-page 6
Preliminary
2013 Microchip Technology Inc.

6 Page









SST11CP22 pdf, datenblatt
SST11CP22
5.0 PACKAGE INFORMATION
20-Lead Ultra Thin Quad Flat Pack, No Lead (GN) - 4x4x0.55 mm Body (UQFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
D
N
AB
1
2
(DATUM B)
(DATUM A)
2X
0.20 C
2X
0.20 C
TOP VIEW
E
C
SEATING
PLANE
A
(A3)
0.10 C
SIDE VIEW
D2
0.08 C
0.10 C A B
A1
K
2
1
0.10 C A B
E2
L
NOTE 1
N
e
BOTTOM VIEW
20 X b
0.07
0.05
CAB
C
Microchip Technology Drawing C04-252A Sheet 1 of 2
DS70005126A-page 12
Preliminary
2013 Microchip Technology Inc.

12 Page





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