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PDF MBT801-S Data sheet ( Hoja de datos )
| Número de pieza | MBT801-S | |
| Descripción | LED | |
| Fabricantes | Seoul Semiconductor | |
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Hay una vista previa y un enlace de descarga de MBT801-S (archivo pdf) en la parte inferior de esta página. Total 11 Páginas | ||
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Specification
MBT801-S
SSC
Drawn
Approval
고객명
Approval
Rev. 01
July 2009
www.acriche.com
1 page  
2. Absolute maximum ratings
Parameter
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Symbol
Pd
IF
IFM *2
VR
Topr
Tstg
Value
120
30
90
5
-40 ~ +100
-40 ~ +100
Unit
mW
mA
mA
V
oC
oC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric characteristics
Parameter
Forward Voltage
Reverse Current
Luminance Intensity *1
Peak Wavelength
Dominant Wavelength
Spectral Bandwidth 50%
Viewing Angle *2
Symbol
VF
IR
IV
λP
λd
∆λ
2θ ½
Condition
IF =20mA
VR=5V
IF =20mA
IF =20mA
IF =20mA
IF =20mA
IF =20mA
Min
2.7
-
70
-
464
-
-
Typ Max Unit
3.2 4.0
V
- 10 µA
335 600 mcd
465 - nm
470 476 nm
23 - nm
120 - deg.
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of
the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
Rev. 01
July 2009
www.acriche.com
5 Page 
9. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on the
surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to
standard encapsulants, silicone is generally softer, and the surface is more likely to
attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the
soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.
Rev. 01
July 2009
www.acriche.com
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet MBT801-S.PDF ] | |
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