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HD66766 Schematic ( Datenblatt PDF ) - Hitachi Semiconductor

Teilenummer HD66766
Beschreibung 132 x 176-dot Graphics LCD Controller/Driver
Hersteller Hitachi Semiconductor
Logo Hitachi Semiconductor Logo 

Gesamt 30 Seiten
		
HD66766 Datasheet, Funktion
HD66766
Rev. 1.0 / 30 November 2001
HD66766
(132 x 176-dot Graphics LCD Controller/Driver for 65K Colors)
Rev.1.0
November, 2001
Description
The HD66766, color-graphics LCD controller and driver LSI, displays 132-by-176-dot graphics for 65K
STN colors. A 16-bit high-speed bus interface and high-speed RAM write function enable efficient data
transfer and high-speed rewriting of data to the graphics RAM.
The HD66766 has various functions for reducing the power consumption of a LCD system, such as low-
voltage operation of 2.2 V/min., a step-up circuit to generate a maximum of 12-times the LCD drive
voltage from the supplied voltage, and voltage-followers to decrease the direct current flow in the LCD
drive bleeder-resistors. Combining these hardware functions with software functions, such as a partial
display with low-duty drive and standby and sleep modes, allows precise power control. The HD66766
is suitable for any mid-sized or small portable battery-driven product requiring long-term driving
capabilities, such as digital cellular phones supporting a WWW browser, bi-directional pagers, and small
PDAs.
Features
132RGB x 176-dot graphics display LCD controller/driver for 65K STN colors
low voltage drive and flickerless PWM grayscale drive
16-/8-bit high-speed bus interface and Clock Synchronized Serial Interface ( SPI )
High-speed burst-RAM write function
Writing to a window-RAM address area by using a window-address function
Bit-operation functions for graphics processing:
- Write-data mask function in bit units.
- Logical operation in pixel unit and conditional write function.
1






HD66766 Datasheet, Funktion
HD66766
Rev. 1.0 / 30 November 2001
HD66766 PAD Arrangement (Laced Output Arrangement)
- Chip Size :18.65mm x 2.63mm
Chip thickness : 550µm (Typ)
- PAD coordinate : PAD center
- Coordinate origin : Chip center
- AU bump size :
(1) 80µm x 80µm
DUMMY1, DUMMY2,
RESET1* to RESET3,
DUMMY10,DUMMY11,DUMMY12,DUMMY13
(2) 38um x 68um
COM1 to COM176
SEG1 to SEG396
- AU bump pitch : Refer PAD coordinate
- AU bump height : 15µm (Typ)
Number in the diagram refers to number on
the PAD coordinate
- Arrangement mark
(1) Arrangement : 2 places
(,) = ( +/- 9000, -1121 )
190um
95
45 30 40 30 45
( 2 - a ) coordination ( X , Y ) = ( -9094, 1145 )
50um
( 2 - b ) coordination ( X , Y ) = ( 9094, 1145 )
20 50um
( 3 - a ) coordination ( X, Y ) = ( -9004, 1145 )
5 10 25 25 10 5
70um
80um
( 3 - b ) Coordination ( X, Y ) = (9004,1145 )
10 25 25 10
70um
NO.1
DUMMY1
DUMMY2
RESET1*
CEP
CEP
CEM
CEM
VCL
VCL
VCL
VCL
VCH
VCH
VCH
VCH
C24+
C24+
C24-
C24-
C23+
C23+
C23-
C23-
C22+
C22+
C22-
C22-
C21+
C21+
C21-
C21-
VCI2
VCI2
VCI2
VCI2
GNDDUM1
GNDDUM4
DB15
DB14
DB13
DB12
DB11
DB10
DB9
DB8
GNDDUM5
DB7
DB6
DB5
DB4
DB3
DB2
DB1/SDO
DB0/SDI
GNDDUM6
RW /RD*
E/W R*/SCL
GNDDUM7
RS
CS*
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
AGND
AGND
GND
GND
GND
GND
AGND
AGND
RESET2*
OSC2
OSC1
GNDDUM8
IM2
VCCDUM1
IM1
GNDDUM9
IM0/ID
VCCDUM2
TEST2
TEST1
GNDDUM10
DUMMY3
DUMMY9
VREFL
VREFL
BIASC
BIASC
VREFM
VREFM
VM
VM
VM
VM
VSH
VSH
VSH
VSH
VOUT
VOUT
VOUT
VOUT
C12+
C12+
C12+
C12+
C12-
C12-
C12-
C12-
C11+
C11+
C11+
C11+
C11-
C11-
C11-
C11-
VCIOUT
VCIOUT
VCIOUT
VCIOUT
VCI1
VCI1
VCI1
VCI1
VCCDUM3
VCCDUM4
RESET3*
DUMMY10
DUMMY11
NO.145
NO.666
DUMMY13
COM107
COM109
COM111
COM113
COM169
COM171
COM173
COM175
SEG1
SEG2
SEG3
SEG4
HD66766
Laced Output
Arrangement
(Top View)
Y
X
SEG393
SEG394
SEG395
SEG396
COM176
COM174
COM172
COM170
COM114
COM112
COM110
COM108
DUMMY12
NO.199
6

6 Page







HD66766 pdf, datenblatt
HD66766
C12+, C12- 2
C21+, C21- 2
C22+, C22- 2
C23+, C23- 2
C24+, C24- 2
CEP, CEM 2
VREFL
1
VREFM 1
BIASC
1
VCC, GND 2
AGND
1
OSC1,
OSC2
2
RESET* 1
VccDUM 1
GNDDUM 1
Dummy
TEST1,
TEST 2
1
2
Rev. 1.0 / 30 November 2001
— Step-up
capacitance
When step-up circuit is used, connect a step-up capacitor.
— Step-up
capacitance
When step-up circuit is used, connect a step-up capacitor.
— Step-up
capacitance
When step-up circuit is used, connect a step-up capacitor.
— Step-up
capacitance
When step-up circuit is used, connect a step-up capacitor.
— Step-up
capacitance
When step-up circuit is used, connect a step-up capacitor.
— Step-up
capacitance or
open
Connect a step-up capacitor to generate VCL level by
VCH and VM. When step-up circuit is not used, leave
this pin open.
— VCC or external Inputs reference voltage for LCD drives power supply.
power supply
Input lower level than Vcc. Since input current does
not run, level input, which is divided by resistors, is also
possible.
— Capacitor for
Connect capacitor for stabilization for internal power
stabilization or supply. When internal operational amplifier is not used,
external power supply external voltage.
supply
— Capacitor for
Connect capacitor for stabilization for internal power
stabilization or supply.
open
— Power supply
VCC: + 1.7 V to + 3.6 V; GND (logic): 0 V
— — GND for power supply circuit.
I/O Oscillation-resistor Connect an external resistor for R-C oscillation. When
providing clocks from outside, input clock to OCS1 and
leave OSC2 open.
I MPU or external Reset pin. Initializes the LSI when low. Must be reset
R-C circuit
after power-on. Since HCD66766BP has three RESET
Open unused pins pins, use one pin and open unused two pins.
O Input pins
Outputs the internal VCC level; shorting this pin sets the
adjacent input pin to the VCC level.
O Input pins
Outputs the internal GND level; shorting this pin sets the
adjacent input pin to the GND level.
——
Dummy pad. Must be left disconnected.
I GND
Test pin. Must be fixed at GND level.
12

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