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PDF CPC1709 Data sheet ( Hoja de datos )
| Número de pieza | CPC1709 | |
| Descripción | DC Power Relay | |
| Fabricantes | Clare | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de CPC1709 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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CPC1709
ISOPLUS™-264 DC Power Relay
Parameter
Blocking Voltage
Load Current, TA=25ºC
With 5°C/W Heat Sink
No Heat Sink
On-resistance
RθJC
Rating
60
22.8
9
0.05
0.3
Units
VP
ADC
Ω
ºC/W
Features
• 100% Solid State
• Compact ISOPLUS-264 Power Package
• Low Thermal Resistance (0.3°C/W)
• 22.8ADC Load Current with 5°C/W Heat Sink
• Electrically Non-conductive Thermal Pad for Heat
Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• 2500Vrms Input/Output Isolation
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Pin Configuration
Description
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new
family of High Power Solid State Relays. As part of
this new family, the CPC1709 single pole normally
open (1-Form-A) DC Solid State Relay employs
optically coupled MOSFET technology to provide
2500Vrms of input to output isolation.
The output is constructed with an efficient MOSFET
switch and photovoltaic die that uses Clare’s patented
OptoMOS architecture while the input GaAlAs
infrared LED provides the optically-coupled control.
The combination of low on-resistance and high load
current handling capability makes this relay suitable
for a variety of high performance DC switching
applications.
The unique ISOPLUS-264 package pioneered by
IXYS allows solid state relays to achieve the highest
load current and power ratings. This package features
an IXYS unique process where the silicon chips are
soft soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500Vrms isolation but also
very low thermal resistance (0.3°C/W).
Approvals
• UL recognized component: File # E69938
• Certified to UL 508
Ordering Information
Part Number Description
CPC1709J
ISOPLUS-264 (25 per tube)
Switching Characteristics of Normally
Open (Form A) Devices
RoHS
2002/95/EC
12
+-
e3
DS-CPC1709-R02
34
-+
www.clare.com
CONTROL
ILOAD
+90%
10%+
TON TOFF
1
1 page  
CPC1709
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
CPC1709
Typical IF for Switch Operation
vs. Temperature
(IL=1ADC)
-20 0 20 40 60 80 100
Temperature (ºC)
PERFORMANCE DATA*
CPC1709
Typical On-Resistance vs. Temperature
0.022
(IL=1ADC)
0.020
0.018
0.016
0.014
I = 10mA
F
0.012
0.010
0.008
0.006
0.004
-40 -20 0
20 40 60
80 100
Temperature (ºC)
CPC1709
Typical On-Resistance vs. Temperature
0.045
(IL=max rated, IF=10mA)
0.040
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-40 -20
0
20 40 60
80 100
Temperature (ºC)
CPC1709
Energy Rating Curve
(Free Air, No Heat Sink)
50
40
30
20
10
0
10μs 100μs 1ms 10ms 100ms 1s
Time
10s 100s
CPC1709
Typical Load Current vs. Load Voltage
(TA=25ºC, IF=10mA)
10
9
8
7
6
5
4
3
2
1
0
0 0.0375 0.0750 0.1125 0.1500 0.1875 0.2250
Load Voltage (V)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R02 www.clare.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CPC1709.PDF ] | |
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