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GC1302 Schematic ( PDF Datasheet ) - Microsemi Corporation

Teilenummer GC1302
Beschreibung ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES
Hersteller Microsemi Corporation
Logo Microsemi Corporation Logo 




Gesamt 4 Seiten
GC1302 Datasheet, Funktion
MICROWAVE PRODUCTS DIVISION
KV1913A thru GC1310
ENHANCED PERFORMANCE
SURFACE MOUNT "EPSM" PACKAGED DEVICES
PRODUCT PREVIEW
DESCRIPTION
Our EPSM packaged devices are designed for the most demanding
commercial and Military requirements where the inconsistency of
performance inherent in plastic surface mount packages cannot be
tolerated. These package styles extend the surface mount construction
format to 6 GHz for high performance wireless applications including
VCO's, limiters, pin switches and pin attenuators. Select varactors from
three families of C/V curves for designs through 6 GHz. They are available
in multiple chip configuration as well as outlines which directly replace
SOT-23 and SOD-323 devices. Other devices and values are always
available - contact our applications engineering department for more
details.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
KEY FEATURES
!"Frequencies from VHF to 6
GHz
!"Lower Parasitics
!"Mil Grade Ceramic/Epoxy
Amalgam Construction
!"Dense SiO2 Junction
Passivation
!"Superior
Consistency/Repeatability
!"Footprints Available for
SOT-23/SOD-323/SOD-123
!"Priced for Commercial
Products
!"Tape & Reel for Volume
Pick & Place
APPLICATIONS/BENEFITS
!"High performance wireless
surface mounting including:
!"GSM
!"TAGS
!"WANS
!"PCS
!"AMPS
!"DECT
!"CELLULAR
Copyright 2000
MSC1375.PDF 2000-11-06
Microsemi
Microwave Products Division
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
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