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PDF L6221C Data sheet ( Hoja de datos )
| Número de pieza | L6221C | |
| Descripción | QUAD DARLINGTON SWITCH | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de L6221C (archivo pdf) en la parte inferior de esta página. Total 15 Páginas | ||
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L6221C
L6221CN/CD
. FOUR NON INVERTING INPUTS WITH
ENABLE
. OUTPUT VOLTAGE UP TO 60 V
. OUTPUT CURRENT UP TO 1.8 A
. VERY LOW SATURATION VOLTAGE
. TTL COMPATIBLE INPUTS
. INTEGRAL FAST RECIRCULATION DIODES
QUAD DARLINGTON SWITCH
Multiwatt 15
Powerdip 12 + 2 + 2
DE SCR I P TI O N
The L6221 monolithic quad darlington switch is de-
signedfor high current, high voltageswitching appli-
cations. Each of the four switches is controlled by a
logic input and all four are controlled by a common
enableinput.All inputsare TTL-compatiblefor direct
connection to logic circuits.
Eachswitch consists of an open-collectordarlington
transistorplus a fast diodefor switchingapplications
with inductivedevice loads. The emitters of thefour-
switches are commoned. Any numberof inputs and
BLOCK DIAGRAM
SO16 + 2 + 2
ORDERING NUMBERS :L6221C (Powerdip 12+2+2)
L6221CN (Multiwatt 15 )
L6221CD (SO16+2+2)
outputs of the same device may be paralleled.
Three versions are available : the L6221C mounted
in a Powerdip 12 + 2 + 2 package and the L6221CN
mounted in a 15--lead Multiwatt package, the
L6221CDin SO16+2+2 package.
May 1997
1/15
1 page  
TEST CIRCUITS
(X) = Referred to Multiwatt package
X = Referred to Powerdip package
Figure 1 : Logic supply current.
L6 2 21 C - L6 2 21 C N -L 622 1C D
Set V IN = 4.5V, V EN = 0.8V, or V IN = 0.8V, V EN = 4.5V, for I S (all outputs off)
Set V IN = 2V, V EN = 2V, for I S (all outputs on)
Figure 2 : Output Sustaining Voltage.
Figure 3 : Output Leakage Current.
VP = +60V
5/15
5 Page 
L6 2 21 C - L6 2 21 C N -L 622 1C D
MOUNTING INSTRUCTION
The Rth j-amb of the L6221C can be reduced by sol-
deringthe GND pins to a suitablecopperarea of the
printed circuit board (Fig. 23) or to an external
heatsink (Fig. 24).
The diagram of figure 25 shows the maximum dis-
sipable power Ptot and the Rth j-amb as a function of
the side ” α” of two equal square copper areas hav-
Figure 23 : Example of P.C. Board Copper
Area Which is Used as Heatsink.
ing a thickness of 35µ (1.4 mils). During soldering
the pins temperature must not exceed 260 °C and
the soldering time must not be longer than 12 sec-
onds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 24 : External Heatsink Mounting
Exa mple.
Figure 25 : Maximum Dissipable Power
and Junction to Ambient Ther-
mal Resistance vs. Side ” α”.
Figure 26 : Maximum Allowable Power
Dissipation vs. Ambient
Temperature.
11/15
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet L6221C.PDF ] | |
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