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PDF STPS2H100 Data sheet ( Hoja de datos )
| Número de pieza | STPS2H100 | |
| Descripción | Power Schottky rectifier | |
| Fabricantes | STMicroelectronics | |
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A
K
SMA
STPS2H100A
A
K
SMB
STPS2H100U
A
K
SMAflat
STPS2H100AF
A
K
SMBflat
STPS2H100UF
Table 1. Device summary
Symbol
Value
IF(AV)
VRRM
Tj (max)
VF (max)
2A
100 V
175 °C
0.65 V
STPS2H100
Power Schottky rectifier
Datasheet - production data
Features
Negligible switching losses
High junction temperature capability
Low leakage current
Good trade-off between leakage current and
forward voltage drop
Avalanche capability specified
Description
Schottky rectifiers designed for high frequency
miniature switched mode power supplies such as
adapters and on board DC/DC converters.
Available in SMA, low-profile SMA, SMB, low-
profile SMB.
June 2013
This is information on a product in full production.
DocID6115 Rev 8
1/12
www.st.com
1 page  
STPS2H100
Characteristics
Figure 13. Forward voltage drop versus forward Figure 14. Forward voltage drop versus forward
current (low level)
current (high level)
2.0 IFM(A)
1.8
1.6
Tj=125°C
(Maximum values)
1.4
1.2
Tj=125°C
1.0 (Typical values)
0.8
Tj=25°C
0.6 (Maximum values)
0.4
0.2 VFM(V)
0.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
100 IFM(A)
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
10
Tj=25°C
(Maximum values)
VFM(V)
1
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
Figure 15. Thermal resistance junction to
Figure 16. Thermal resistance junction to
ambient versus copper surface under each lead ambient versus copper surface under each lead
(SMA)
(SMAflat)
Rth(j-a)(°C/W)
130
120
110
100
90
80
70
60
50
40
30
20
10
0
0.0 0.5 1.0
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
SCU(cm²)
1.5 2.0 2.5 3.0 3.5
4.0
SMA
4.5 5.0
200 Rth(j-a)(°C/W)
180
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
160
140
120
100
SMAflat
80
60
40
20
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 17. Thermal resistance junction to
Figure 18. Thermal resistance junction to
ambient versus copper surface under each lead ambient versus copper surface under each lead
(SMB)
(SMBflat)
Rth(j-a)(°C/W)
110
100
90
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
SMB
80
70
60
50
40
30
20
10 SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Rth(j-a)(°C/W)
110
100
90
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
80
70
60
50 SMBflat
40
30
20
10 SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DocID6115 Rev 8
5/12
12
5 Page 
STPS2H100
3 Ordering information
Ordering information
Order code
STPS2H100A
STPS2H100AF
STPS2H100U
STPS2H100UF
Table 9. Ordering information
Marking
Package
Weight Base qty Delivery mode
S21
SMA
0.068 g
5000
Tape and reel
F21
SMAflat
0.035 g 10000 Tape and reel
G21
SMB
0.107 g
2500
Tape and reel
FG21
SMBflat
0.050 g
5000
Tape and reel
4 Revision history
Date
Jul-2003
Aug-2004
08-Feb-2007
15-Feb-2010
24-Jun-2013
Table 10. Document revision history
Revision
Changes
4A Last update.
5
SMA package dimensions update. Reference A1 max.
changed from 2.70 (0.106 inches) to 2.03 mm (0.080 inches).
6
Reformatted to current standards. Added ECOPACK
statement. Added SMBflat package.
7 Updated weight for SMBflat in Table 9.
8 Added SMAflat package
DocID6115 Rev 8
11/12
12
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet STPS2H100.PDF ] | |
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