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PDF KLMBG8FEJA-A001 Data sheet ( Hoja de datos )
| Número de pieza | KLMBG8FEJA-A001 | |
| Descripción | e.MMC moviNAND | |
| Fabricantes | Samsung | |
| Logotipo |  |
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Hello All,
8/16/32GB 27nm eMMC parts are now available to sample (CS type)! Please input sample requests for all
customers using old generations of moviNAND now. We'll expedite for ASAP delivery.
SEC will ramp 27nm production quickly so it is imperative that all customers get qualified ASAP.
Please work closely with FAE and SSI Marketing should there be any issues with converting to 27nm.
Thank you!
• 27nm sample schedule:
• Updated datasheet:
<<KLMXGXFEJA-X001(MMC4 41 2xnm based moviNAND)1 0.pdf>>
Best regards,
Tuoi
Notice: Unless specifically identified as a firm offer or an offer to sell, this message is not an offer of sale. Any terms stated in this message
or prices quoted are merely indications of terms on which Samsung Semiconductor, Inc. may consider selling, and are not intended to be
binding.
1 page  
KLMXGXFEJA
datasheet
Rev. 1.0
moviNAND
INTRODUCTION
The SAMSUNG moviNAND is an embedded MMC solution designed in a BGA package form. moviNAND operation is identical to a MMC card and there-
fore is a simple read and write to memory using MMC protocol v4.41 which is a industry standard.
moviNAND consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF) whereas 1.8V or 3V dual supply volt-
age (VDD) is supported for the MMC controller. Maximum MMC interface frequency of 52MHz and maximum bus widths of 8 bit are supported.
There are several advantages of using moviNAND. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC
host. Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads
to faster product development as well as faster times to market.
The embedded flash mangement software or FTL(Flash Transition Layer) of moviNAND manages Wear Leveling, Bad Block Management and ECC. The
FTL supports all features of the Samsung NAND flash and achieves optimal performance.
1.0 PRODUCT LIST
Capacities
8GB
16GB
32GB
64GB
moviNAND Part ID
KLM8G2FEJA-A001
KLMAG4FEJA-A001
KLMAG4FEJA-B001
KLMBG8FEJA-A001
KLMCGAFEJA-B001
NAND Flash Type
32Gb MLC x 2
32Gb MLC x 4
32Gb MLC x 8
32Gb MLC x 16
Power System
- Interface power : VDD
(1.70V ~ 1.95V or 2.7V ~ 3.6V)
- Memory power : VDDF
(2.7V ~ 3.6V)
Package size
Pin Configuration
12mm x 16mm x 1.2mm
14mm x 18mm x 1.0mm
12mm x 16mm x 1.4mm
14mm x 18mm x 1.4mm
169FBGA
2.0 KEY FEATURES
• MultiMediaCard System Specification Ver. 4.41 compatible. Detail description is referenced by JEDEC Standard
• SAMSUNG moviNAND supports below special features which are being discussed in JEDEC
- High Priority Interrupt scheme is supported
- Back ground operation is supported.
• Full backward compatibility with previous MultiMediaCard system ( 1bit data bus, multi-moviNAND systems)
• Data bus width : 1bit (Default) , 4bit and 8bit
• MMC I/F Clock Frequency : 0~ 52MHz
MMC I/F Boot Frequency : 0~ 52MHz
• Temperature : Operation(-25°C~85°C), Storage without operation (-40°C ~ 85°C)
• Power : Interface power --> VDD (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power --> VDDF(2.7V ~ 3.6V)
-5-
5 Page 
KLMXGXFEJA
datasheet
3.2 Product Architecture
- moviNAND consists of NAND Flash and Controller. VDD is for Controller power and VDDF is for flash power
VDDF
VDD
RESET
VDDi
CReg
CLK
CMD
DAT[7:0]
Core Regulator
(Required for 3.3V VDD)
Core
Logic
Block
MMC Controller
Control Signal
Data Bus
Memory
Figure 6. moviNAND Block Diagram
Rev. 1.0
moviNAND
- 11 -
11 Page | ||
| Páginas | Total 33 Páginas | |
| PDF Descargar | [ Datasheet KLMBG8FEJA-A001.PDF ] | |
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