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Número de pieza | PSMN2R7-30BL | |
Descripción | MOSFET ( Transistor ) | |
Fabricantes | NXP Semiconductors | |
Logotipo | ||
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N-channel 30 V 3.0 mΩ logic level MOSFET in D2PAK
Rev. 1 — 21 March 2012
Product data sheet
1. Product profile
1.1 General description
Logic level N-channel MOSFET in D2PAK package qualified to 175 °C. This product is
designed and qualified for use in a wide range of industrial, communications and domestic
equipment.
1.2 Features and benefits
High efficiency due to low switching
and conduction losses
Suitable for logic level gate drive
sources
1.3 Applications
DC-to-DC converters
Load switiching
Motor control
Server power supplies
1.4 Quick reference data
Table 1. Quick reference data
Symbol
Parameter
VDS drain-source voltage
ID drain current
Ptot total power dissipation
Tj junction temperature
Static characteristics
RDSon
drain-source on-state
resistance
Dynamic characteristics
QGD
QG(tot)
gate-drain charge
total gate charge
Avalanche ruggedness
EDS(AL)S
non-repetitive
drain-source
avalanche energy
Conditions
Tj ≥ 25 °C; Tj ≤ 175 °C
Tmb = 25 °C; VGS = 10 V; see Figure 1
Tmb = 25 °C; see Figure 2
VGS = 10 V; ID = 25 A; Tj = 100 °C;
see Figure 13; see Figure 12
VGS = 10 V; ID = 25 A; Tj = 25 °C;
see Figure 12
VGS = 4.5 V; ID = 25 A; VDS = 15 V
VGS = 4.5 V; ID = 25 A; VDS = 15 V;
see Figure 14; see Figure 15
VGS = 10 V; Tj(init) = 25 °C; ID = 100 A;
Vsup ≤ 30 V; RGS = 50 Ω; unclamped
[1] Continuous current is limited by package.
Min Typ Max Unit
- - 30 V
[1] - - 100 A
- - 170 W
-55 -
175 °C
- 3.6 4.2 mΩ
-
2.57 3
mΩ
- 8 - nC
- 32 - nC
- - 300 mJ
1 page NXP Semiconductors
PSMN2R7-30BL
N-channel 30 V 3.0 mΩ logic level MOSFET in D2PAK
6. Thermal characteristics
Table 6.
Symbol
Rth(j-mb)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to mounting base
thermal resistance from
junction to ambient
Conditions
see Figure 4
minimum footprint; mounted on
a printed-circuit board
Min Typ Max Unit
- 0.54 0.88 K/W
- 50 - K/W
1
Zth(j-mb) δ = 0.5
(K/W)
0.2
10-1 0.1
0.05
0.02
10-2
003aad355
P δ = tp
T
10-3
single shot
10-4
10-6
10-5
10-4
10-3
10-2
tp
T
10-1 tp (s)
t
1
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration; typical
values
PSMN2R7-30BL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 March 2012
© NXP B.V. 2012. All rights reserved.
5 of 15
5 Page NXP Semiconductors
PSMN2R7-30BL
N-channel 30 V 3.0 mΩ logic level MOSFET in D2PAK
8. Package outline
Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)
SOT404
D1
D
HD
E
2
13
ee
b
A
A1
mounting
base
Lp
c
Q
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A1 b
c
D
max.
D1
mm 4.50 1.40 0.85 0.64 11 1.60
4.10 1.27 0.60 0.46
1.20
E
10.30
9.70
e
2.54
Lp HD Q
2.90 15.80 2.60
2.10 14.80 2.20
OUTLINE
VERSION
SOT404
IEC
REFERENCES
JEDEC
JEITA
Fig 18. Package outline SOT404 (D2PAK)
EUROPEAN
PROJECTION
ISSUE DATE
05-02-11
06-03-16
PSMN2R7-30BL
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 March 2012
© NXP B.V. 2012. All rights reserved.
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