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PDF AT25DF641A Data sheet ( Hoja de datos )

Número de pieza AT25DF641A
Descripción 64-Mbit 2.7V Minimum Serial Peripheral Interface Serial Flash Memory
Fabricantes ATMEL Corporation 
Logotipo ATMEL Corporation Logotipo



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Features
Single 2.7V - 3.6V Supply
Serial Peripheral Interface (SPI) Compatible
– Supports SPI Modes 0 and 3
– Supports Atmel RapidS Operation
– Supports Dual-Input Program and Dual-Output Read
Very High Operating Frequencies
– 100MHz for RapidS
– 85MHz for SPI
– Clock-to-Output (tV) of 5ns Maximum
Flexible, Optimized Erase Architecture for Code + Data Storage Applications
– Uniform 4-Kbyte Block Erase
– Uniform 32-Kbyte Block Erase
– Uniform 64-Kbyte Block Erase
– Full Chip Erase
Individual Sector Protection with Global Protect/Unprotect Feature
– 128 Sectors of 64-Kbytes Each
Hardware Controlled Locking of Protected Sectors via WP Pin
Sector Lockdown
– Make Any Combination of 64-Kbyte Sectors Permanently Read-Only
128-Byte Programmable OTP Security Register
Flexible Programming
– Byte/Page Program (1- to 256-Bytes)
Fast Program and Erase Times
– 1.0ms Typical Page Program (256-Bytes) Time
– 50ms Typical 4-Kbyte Block Erase Time
– 250ms Typical 32-Kbyte Block Erase Time
– 400ms Typical 64-Kbyte Block Erase Time
Program and Erase Suspend/Resume
Automatic Checking and Reporting of Erase/Program Failures
Software Controlled Reset
JEDEC Standard Manufacturer and Device ID Read Methodology
Low Power Dissipation
– 5mA Active Read Current (Typical at 20MHz)
– 5µA Deep Power-Down Current (Typical)
Endurance: 100,000 Program/Erase Cycles
Data Retention: 20 Years
Complies with Full Industrial Temperature Range
Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options
– 8-lead SOIC (208-mil wide)
– 8-contact Ultra Thin DFN (5mm x 6mm x 0.6mm)
64-Mbit
2.7V Minimum
Serial Peripheral
Interface Serial
Flash Memory
Atmel AT25DF641A
Preliminary
8693A–DFLASH–8/10

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AT25DF641A pdf
3. Block Diagram
Figure 3-1. Block Diagram
CS
SCK
SI (SIO)
SO (SOI)
WP
HOLD
INTERFACE
CONTROL
AND
LOGIC
Atmel AT25DF641A [Preliminary]
CONTROL AND
PROTECTION LOGIC
Y-DECODER
X-DECODER
I/O BUFFERS
AND LATCHES
SRAM
DATA BUFFER
Y-GATING
FLASH
MEMORY
ARRAY
4. Memory Array
To provide the greatest flexibility, the memory array of the Atmel® AT25DF641A can be erased
in four levels of granularity including a full chip erase. In addition, the array has been divided into
physical sectors of uniform size, of which each sector can be individually protected from pro-
gram and erase operations. The size of the physical sectors is optimized for both code and data
storage applications, allowing both code and data segments to reside in their own isolated
regions. The Memory Architecture Diagram illustrates the breakdown of each erase level as well
as the breakdown of each physical sector.
8693A–DFLASH–8/10
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AT25DF641A arduino
Atmel AT25DF641A [Preliminary]
Deasserting the CS pin will terminate the read operation and put the SO and SIO pins into a
high-impedance state. The CS pin can be deasserted at any time and does not require that a full
byte of data be read.
Figure 7-4. Dual-Output Read Array
CS
SCK
SIO
SO
0 1 2 3 4 5 6 7 8 9 10 11 12
29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48
OPCODE
ADDRESS BITS A23-A0
DON'T CARE
OUTPUT
DATA BYTE 1
OUTPUT
DATA BYTE 2
00 111011AAAAAA
MSB MSB
A A A X X X X X X X X D6 D4 D2 D0 D6 D4 D2 D0 D6 D4
MSB
HIGH-IMPEDANCE
D7 D5 D3 D1 D7 D5 D3 D1 D7 D5
MSB MSB MSB
8. Program and Erase Commands
8.1 Byte/Page Program
The Byte/Page Program command allows anywhere from a single byte of data to 256-bytes of
data to be programmed into previously erased memory locations. An erased memory location is
one that has all eight bits set to the logical “1” state (a byte value of FFh). Before a Byte/Page
Program command can be started, the Write Enable command must have been previously
issued to the device (see “Write Enable” on page 20) to set the Write Enable Latch (WEL) bit of
the Status Register to a logical “1” state.
To perform a Byte/Page Program command, an opcode of 02h must be clocked into the device
followed by the three address bytes denoting the first byte location of the memory array to begin
programming at. After the address bytes have been clocked in, data can then be clocked into the
device and will be stored in an internal buffer.
If the starting memory address denoted by A23-A0 does not fall on an even 256-byte page
boundary (A7-A0 are not all 0), then special circumstances regarding which memory locations to
be programmed will apply. In this situation, any data that is sent to the device that goes beyond
the end of the page will wrap around back to the beginning of the same page. For example, if the
starting address denoted by A23-A0 is 0000FEh, and three bytes of data are sent to the device,
then the first two bytes of data will be programmed at addresses 0000FEh and 0000FFh while
the last byte of data will be programmed at address 000000h. The remaining bytes in the page
(addresses 000001h through 0000FDh) will not be programmed and will remain in the erased
state (FFh). In addition, if more than 256-bytes of data are sent to the device, then only the last
256 bytes sent will be latched into the internal buffer.
When the CS pin is deasserted, the device will take the data stored in the internal buffer and pro-
gram it into the appropriate memory array locations based on the starting address specified by
A23-A0 and the number of data bytes sent to the device. If less than 256-bytes of data were sent
to the device, then the remaining bytes within the page will not be programmed and will remain
in the erased state (FFh). The programming of the data bytes is internally self-timed and should
take place in a time of tPP or tBP if only programming a single byte.
8693A–DFLASH–8/10
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