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PDF HSMS-2865 Data sheet ( Hoja de datos )
| Número de pieza | HSMS-2865 | |
| Descripción | Surface Mount Microwave Schottky Detector Diodes | |
| Fabricantes | Agilent Technologies | |
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Surface Mount Microwave
Schottky Detector Diodes
Technical Data
HSMS-2850 Series
HSMS-2860 Series
Features
• Surface Mount SOT-23/
SOT-143 Package
• High Detection Sensitivity:
up to 50 mV/µW at 915 MHz
up to 35 mV/µW at 2.45 GHz
up to 25 mV/µW at 5.80 GHz
• Low Flicker Noise:
-162 dBV/Hz at 100 Hz
• Low FIT (Failure in Time)
Rate*
• Tape and Reel Options
Available
* For more information see the Surface
Mount Schottky Reliability Data Sheet.
HSMS-2860
Package Lead Code
Identification
SINGLE
3
SERIES
3
12
#0
COMMON
ANODE
3
12
#2
COMMON
CATHODE
3
12
#3
12
#4
UNCONNECTED
PAIR
34
12
#5
HSMS-2850
Package Lead Code
Identification
SINGLE
3
SERIES
3
12
#0
12
#2
UNCONNECTED
PAIR
34
12
#5
Description
Hewlett-Packard’s HSMS-2850
family of zero bias Schottky
detector diodes and the
HSMS-2860 family of DC biased
detector diodes have been
designed and optimized for use
from 915 MHz to 5.8 GHz. They
are ideal for RF/ID and RF Tag
applications requiring small and
large signal detection, modula-
tion, RF to DC conversion or
voltage doubling.
Available in various package
configurations, these two families
of detector diodes provide low
cost solutions to a wide variety of
design problems. Hewlett-
Packard’s manufacturing
techniques assure that when two
diodes are mounted into a single
SOT-23 or SOT-143 package, they
are taken from adjacent sites on
the wafer, assuring the highest
possible degree of match.
1 page  
5
Profile Option Descriptions
-BLK = Bulk
-TR1 = 3K pc. Tape and Reel, Device Orientation; See Figures 9 and 10
-TR2 = 10K pc. Tape and Reel, Device Orientation; See Figures 9 and 10
Tape and Reeling conforms to Electronic Industries RS-481, “Taping of
Surface Mounted Components for Automated Placement.”
Ordering Information
Specify part number followed by option under. For example:
H SMS - 28XX - XXX
Bulk or Tape and Reel Option
Part Number
Surface Mount Schottky
Hewlett-Packard
Package Characteristics
Lead Material
Lead Finish
Max. Soldering Temp.
Min. Lead Strength
Typical Package Inductance
Typical Package Capacitance
Alloy 42
Tin-Lead 85/15%
260°C for 5 sec.
2 pounds pull
2 nH (opposite leads)
0.08 pF (opposite leads)
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet HSMS-2865.PDF ] | |
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