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PDF FDZ375P Data sheet ( Hoja de datos )

Número de pieza FDZ375P
Descripción P-Channel 1.5V Specified PowerTrench Thin WL-CSP MOSFET
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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No Preview Available ! FDZ375P Hoja de datos, Descripción, Manual

April 2010
FDZ375P
P-Channel 1.5 V Specified PowerTrench® Thin WL-CSP MOSFET
-20 V, -3.7 A, 78 m
Features
General Description
„ Max rDS(on) = 78 mat VGS = -4.5 V, ID = -2.0 A
„ Max rDS(on) = 92 mat VGS = -2.5 V, ID = -1.5 A
„ Max rDS(on) = 112 mat VGS = -1.8 V, ID = -1.0 A
„ Max rDS(on) = 150 mat VGS = -1.5 V, ID = -1.0 A
„ Occupies only 1.0 mm2 of PCB area. Less than 30% of the
area of 2 x 2 BGA
Designed on Fairchild's advanced 1.5 V PowerTrench® process
with state of the art "fine pitch" Thin WLCSP packaging process,
the FDZ375P minimizes both PCB space and rDS(on). This
advanced WLCSP MOSFET embodies a breakthrough in
packaging technology which enables the device to combine
excellent thermal transfer characteristics, ultra-low profile
packaging, low gate charge, and low rDS(on).
„ Ultra-thin package: less than 0.4 mm height when mounted to
PCB
„ RoHS Compliant
Applications
„ Battery management
„ Load switch
„ Battery protection
S
DS
G
Pin 1
S
G
BOTTOM
Pin 1
TOP
WL-CSP 1.0X1.0 Thin
D
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted
Symbol
VDS
VGS
ID
PD
TJ, TSTG
Parameter
Drain to Source Voltage
Gate to Source Voltage
-Continuous
-Pulsed
TA = 25°C
Power Dissipation
TA = 25°C
Power Dissipation
TA = 25°C
Operating and Storage Junction Temperature Range
Thermal Characteristics
(Note 1a)
(Note 1a)
(Note 1b)
Ratings
-20
±8
-3.7
-12
1.7
0.5
-55 to +150
Units
V
V
A
W
°C
RθJA
RθJA
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Package Marking and Ordering Information
(Note 1a)
(Note 1b)
75
260
°C/W
Device Marking
N
Device
FDZ375P
Package
WL-CSP 1.0X1.0 Thin
Reel Size
7”
Tape Width
8 mm
Quantity
5000 units
©2010 Fairchild Semiconductor Corporation
FDZ375P Rev.C
1
www.fairchildsemi.com
http://www.Datasheet4U.com

1 page




FDZ375P pdf
Dimensional Outline and Pad Layout
©2010 Fairchild Semiconductor Corporation
FDZ375P Rev.C
5
www.fairchildsemi.com

5 Page










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