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MOC211M Schematic ( PDF Datasheet ) - FAIRCHILD

Teilenummer MOC211M
Beschreibung Small Ouline Optocouplers Transistor Output
Hersteller FAIRCHILD
Logo FAIRCHILD Logo 




Gesamt 10 Seiten
MOC211M Datasheet, Funktion
April 2013
MOC211M, MOC212M, MOC213M
Small Ouline Optocouplers Transistor Output
Features
UL Recognized (File #E90700, Volume 2)
VDE Recognized (File #136616) (add option ‘V’ for
VDE approval, e.g., MOC211VM)
Convenient Plastic SOIC-8 Surface Mountable
Package Style
Standard SOIC-8 Footprint, with 0.050" Lead Spacing
High Input-Output Isolation of 2500 VAC(rms)
Guaranteed
Minimum BVCEO of 30V Guaranteed
Applications
General Purpose Switching Circuits
Interfacing and Coupling Systems of Different
Potentials and Impedances
Regulation Feedback Circuits
Monitor and Detection Circuits
Description
These devices consist of a gallium arsenide infrared
emitting diode optically coupled to a monolithic silicon
phototransistor detector, in a surface mountable, small
outline, plastic package. They are ideally suited for high
density applications, and eliminate the need for through-
the-board mounting.
Schematic
ANODE 1
CATHODE 2
N/C 3
N/C 4
8 N/C
7 BASE
6 COLLECTOR
5 EMITTER
Figure 1. Schematic
Package Outline
Figure 2. Package Outline
©2005 Fairchild Semiconductor Corporation
MOC211M, MOC212M, MOC213M Rev. 1.0.2
www.fairchildsemi.com
http://www.Datasheet4U.com






MOC211M Datasheet, Funktion
Package Dimensions
8-pin SOIC Surface Mount
8
0.164 (4.16)
0.144 (3.66)
1
0.202 (5.13)
0.182 (4.63)
0.143 (3.63)
0.123 (3.13)
0.021 (0.53)
0.011 (0.28)
0.050 (1.27) Typ.
Lead Coplanarity: 0.004 (0.10) MAX
0.008 (0.20)
0.003 (0.08)
0.010 (0.25)
0.006 (0.16)
0.244 (6.19)
0.224 (5.69)
Recommended Pad Layout
0.024 (0.61)
0.275 (6.99)
0.155 (3.94)
0.060 (1.52)
0.050 (1.27)
Dimensions in inches (mm).
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2005 Fairchild Semiconductor Corporation
MOC211M, MOC212M, MOC213M Rev. 1.0.2
6
www.fairchildsemi.com

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