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Teilenummer | MCR100 |
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Beschreibung | Sensitive Gate Silicon Controlled Rectifiers | |
Hersteller | ON Semiconductor | |
Logo | ||
Gesamt 7 Seiten MCR100 Series
Sensitive Gate
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
PNPN devices designed for high volume, line-powered consumer
applications such as relay and lamp drivers, small motor controls, gate
drivers for larger thyristors, and sensing and detection circuits.
Supplied in an inexpensive plastic TO-226AA package which is
readily adaptable for use in automatic insertion equipment.
Features
• Sensitive Gate Allows Triggering by Microcontrollers and Other
Logic Circuits
• Blocking Voltage to 600 V
• On−State Current Rating of 0.8 A RMS at 80°C
• High Surge Current Capability − 10 A
• Minimum and Maximum Values of IGT, VGT and IH Specified
for Ease of Design
• Immunity to dV/dt − 20 V/msec Minimum at 110°C
• Glass-Passivated Surface for Reliability and Uniformity
• Pb−Free Packages are Available*
http://onsemi.com
SCRs
0.8 A RMS
100 thru 600 V
G
AK
TO−92
CASE 29
STYLE 10
123
STRAIGHT LEAD
BULK PACK
12 3
BENT LEAD
TAPE & REEL
AMMO PACK
MARKING DIAGRAM
MCR
100−x
AYWWG
G
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2010
February, 2010 − Rev. 10
1
x = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
1 Cathode
2 Gate
3 Anode
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
Publication Order Number:
MCR100/D
Free Datasheet http://www.Datasheet4U.com
MCR100 Series
TO−92 EIA RADIAL TAPE IN BOX OR ON REEL
H2A H2A
H2B H2B
H
H4 H5
W2
L1 H1
W1 W
L
F1
F2
P2 P2
D
P1
P
Figure 7. Device Positioning on Tape
T1
T
T2
Specification
Inches
Millimeter
Symbol
Item
Min Max Min Max
D Tape Feedhole Diameter
0.1496
0.1653
3.8
4.2
D2 Component Lead Thickness Dimension
0.015
0.020
0.38
0.51
F1, F2 Component Lead Pitch
0.0945
0.110
2.4
2.8
H Bottom of Component to Seating Plane
.059
.156
1.5
4.0
H1 Feedhole Location
0.3346
0.3741
8.5
9.5
H2A Deflection Left or Right
0 0.039 0
1.0
H2B Deflection Front or Rear
0 0.051 0
1.0
H4 Feedhole to Bottom of Component
0.7086
0.768
18
19.5
H5 Feedhole to Seating Plane
0.610
0.649
15.5
16.5
L Defective Unit Clipped Dimension
0.3346
0.433
8.5
11
L1 Lead Wire Enclosure
0.09842
—
2.5
—
P Feedhole Pitch
0.4921
0.5079
12.5
12.9
P1 Feedhole Center to Center Lead
0.2342
0.2658
5.95
6.75
P2 First Lead Spacing Dimension
0.1397
0.1556
3.55
3.95
T Adhesive Tape Thickness
0.06
0.08
0.15
0.20
T1 Overall Taped Package Thickness
— 0.0567 —
1.44
T2 Carrier Strip Thickness
0.014
0.027
0.35
0.65
W Carrier Strip Width
0.6889
0.7481
17.5
19
W1 Adhesive Tape Width
0.2165
0.2841
5.5
6.3
W2 Adhesive Tape Position
.0059
0.01968
.15
0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements.
4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Hold down tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
http://onsemi.com
6
Free Datasheet http://www.Datasheet4U.com
6 Page | ||
Seiten | Gesamt 7 Seiten | |
PDF Download | [ MCR100 Schematic.PDF ] |
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