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PDF NCP1209 Data sheet ( Hoja de datos )

Número de pieza NCP1209
Descripción PWM Voltage Mode Controller
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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No Preview Available ! NCP1209 Hoja de datos, Descripción, Manual

NCP1209
Product Preview
PWM Voltage Mode
Controller
The NCP1209P series is an enhanced version of the MC44608P
series. It is a high performance voltage mode controller designed for
fly–back SMPS.
These 2 series are pin to pin compatible. The device is a Power
MOSFET driver offering a discrete approach (controller + discrete
MOSFET) for building an offline SMPS.
It features a very high efficiency stand–by management consisting
in a fully controlled and adaptable Pulsed Mode operation working in
conjunction with a secondary reconfiguration.
Features
45 kHz, 65 kHz, 77 kHz
7% Frequency Accuracy Over the Whole Temp Range
Extended VCC Working Range 8.6 V to 16 V
Programmable Stand–by Burst Duty Cycle
Stand–by Mode Selection from the Secondary Side of the SMPS
5 mA VHV Start–up Current Source
Device Inhibition Through Start–up Current Source Reduction
Typical Applications
Energy Management in Set Top Box
Opto Feed–back Offline SMPS
SMPS Using a Secondary Reconfiguration for the Stand–by Mode
Ability to Adapt the MOSFET Gate Drive
All General Purpose Fly–back SMPS
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
http://onsemi.com
SMPS CONTROLLER WITH
ENHANCED STAND–BY
MANAGEMENT
8
1
8
1
SO–8
CASE 751
PLASTIC
DIP–8
CASE 626
PLASTIC
MARKING
DIAGRAMS
8
TBD
1
8
TBD
1
xx = Specific Device Code
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
PIN CONNECTIONS
DMG 1
ICS 2
CTRL 3
GND 4
8 Vi
7 NC
6 VCC
5 OUT
(Top View)
ORDERING INFORMATION
Device
NCP1209P45
NCP1209P65
NCP1209P77
Package
TBD
TBD
TBD
Shipping
TBD
TBD
TBD
© Semiconductor Components Industries, LLC, 2002
January, 2002– Rev. 0
1
Publication Order Number:
NCP1209/D
http://www.Datasheet4U.com

1 page




NCP1209 pdf
NCP1209
PACKAGE DIMENSIONS
DIP–8
CASE 626–05
ISSUE L
NOTE 2
85
14
F
–A–
–B–
L
–T–
SEATING
PLANE
H
C
N
DK
G
0.13 (0.005) M T A M B M
J
M
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
F 1.02 1.78 0.040 0.070
G 2.54 BSC
0.100 BSC
H 0.76 1.27 0.030 0.050
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
L 7.62 BSC
0.300 BSC
M --- 10_ --- 10_
N 0.76 1.01 0.030 0.040
http://onsemi.com
5
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