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PDF CPC1117N Data sheet ( Hoja de datos )
| Número de pieza | CPC1117N | |
| Descripción | Normally Closed 4-Lead SOP OptoMOS Relay | |
| Fabricantes | IXYS | |
| Logotipo |  |
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INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to Operate
Rating
60
150
16
1
Units
VP
mArms / mADC
mA
Features
• Designed for use in security systems complying
with EN50130-4
• Only 1mA of LED current required to operate
• 1500Vrms Input/Output Isolation
• Small 4-Lead SOP Package
• TTL/CMOS Compatible input
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Immune to radiated EM fields
• SMD Pick & Place, Wave Solderable
• Tape & Reel Version Available
Applications
• Security
• Passive Infrared Detectors (PIR)
• Data Signalling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
CPC1117N
Single-Pole, Normally Closed
4-Lead SOP OptoMOS® Relay
Description
The CPC1117N is a miniature single-pole, normally
closed (1-Form-B) solid state relay in a 4-lead SOP
package that employs optically coupled MOSFET
technology to provide 1500Vrms of input/output
isolation. The efficient MOSFET switches and
photovoltaic die use IXYS Integrated Circuits Division’s
patented OptoMOS architecture. The optically coupled
output is controlled by the input's highly efficient
GaAlAs infrared LED.
IXYS Integrated Circuits Division’s state of the art
double-molded vertical construction packaging makes
the CPC1117N one of the world’s smallest relays. It
offers board space savings of at least 20% over the
competitor’s larger 4-lead SOP relay.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
Ordering Information
Part #
CPC1117N
CPC1117NTR
Description
4-Lead SOP (100/tube)
4-Lead SOP (2000/reel)
Pin Configuration
1
+ Control
2
– Control
4
Load
3
Load
Switching Characteristics
of Normally Closed Devices
Form-B
IF
ILOAD
10%
toff
90%
ton
Pb
DS-CPC1117N-R08
e3
www.ixysic.com
1
Free Datasheet http://www.datasheet4u.com/
1 page  
INTEGRATED CIRCUITS DIVISION
CPC1117N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
CPC1117N
Moisture Sensitivity Level (MSL) Rating
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
CPC1117N
Maximum Temperature x Time
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb e3
R08 www.ixysic.com
5
Free Datasheet http://www.datasheet4u.com/
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CPC1117N.PDF ] | |
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