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PDF IXA40RG1200DHGLB Data sheet ( Hoja de datos )

Número de pieza IXA40RG1200DHGLB
Descripción XPT IGBT
Fabricantes IXYS 
Logotipo IXYS Logotipo



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No Preview Available ! IXA40RG1200DHGLB Hoja de datos, Descripción, Manual

XPT IGBT
ISOPLUS™ Surface Mount Power Device
Boost Topology
XPT IGBT
Part number
IXA40RG1200DHGLB
IXA40RG1200DHGLB
VCES
I C25
VCE(sat)
=
=
=
tentative
1200 V
61 A
1.8 V
Features / Advantages:
XPT IGBT
- low saturation voltage
- positive temperature coefficient
for easy paralleling
- fast switching
- short tail current for optimized
performance in resonant circuits
Sonic™ diode
- fast reverse recovery
- low operating forward voltage
- low leakage current
- low temperature dependency of
reverse recovery
Vcesat detection diode (VDD)
- integrated into package
- very fast diode
VDD
1
7
BD
9
3 FWD
2
8
Applications:
AC drives
- brake chopper
PFC
- boost chopper
Switched reluctance drives
Backside: isolated
Package: SMPD
Industry convenient outline
RoHS compliant
Epoxy meets UL 94V-0
Soldering pins for PCB mounting
Backside: DCB ceramic
Reduced weight
Advanced power cycling
Isolation Voltage: 3000 V~
IXYS reserves the right to change limits, conditions and dimensions.
© 2012 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20120618
Free Datasheet http://www.datasheet4u.com/

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IXA40RG1200DHGLB pdf
Outlines SMPD
(6x) 1 `0,05 2)
0,5 `0,1
25 `0,2 1)
18 `0,1
9 `0,1
(3x) 2 `0,05 2)
789
IXA40RG1200DHGLB
tentative
A(8:1)
0 + 0,15
c 0,1
4 `0,05
seating plane
0,55 `0,1
6 54
321
3)
c 0,05
A
2,75 `0,1
5,5 `0,1
13,5 `0,1
16,25 `0,1
19 `0,1
Pin number
Notes:
1) potrusion may add 0.2 mm max. on each side
2) additional max. 0.05 mm per side by punching misalignement
or overlap of dam bar or bending compression
3) DCB area 10 to 50 µm convex;
position of DCB area in relation to plastic rim: ±25 µm
(measured 2 mm from Cu rim)
4) terminal plating: 0.2 - 1 µm Ni + 10 - 25 µm Sn (gal v.)
cutting edges may be partially free of plating
7
VDD
1
BD
9
3 FWD
2
8
IXYS reserves the right to change limits, conditions and dimensions.
© 2012 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20120618
Free Datasheet http://www.datasheet4u.com/

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