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PDF TL12W02-D Data sheet ( Hoja de datos )
| Número de pieza | TL12W02-D | |
| Descripción | LED lamps | |
| Fabricantes | Toshiba Semiconductor | |
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TOSHIBA LED lamps
TL12W02-D(T30)
TL12W02-D(T30)
○ Surface-Mount Devices
• 10.5 (L) mm × 5.0 (W) mm × 2.1 (H) mm
• High luminous flux: 90 lm(typ.) @250 mA
• Color: white
• Topr / Tstg: -40 to 100°C
• Reflow-solderable
• Standard embossed tape packing: T30 (500 pcs/reel)
24-mm tape reel
• Applications : general lighting
Color and Material
Unit: mm
1
Polarity
2
10.5 ± 0.2
8.0
7.0
LED Chip position
Cathode index
Part Number
Color
Material
TL12W02-D
White
InGaN
Absolute Maximum Ratings (Ta = 25°C)
1
1.Anode
2.Cathode
2
(1.0)
Tolerance : ± 0.15
*This size is includes burr
Characteristics
Forward Current
Power Dissipation
Operating Temperature
Storage Temperature
Symbol
IF
PD
Topr
Tstg
Rating
300
2.37
−40 to 100
−40 to 100
Unit
mA
W
°C
°C
JEDEC
―
JEITA
―
TOSHIBA
4-5AY1
Weight: 0.30 g (typ.)
Junction Temperature
Tj 110 °C
Note 1: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/”Derating Concept and Methods”) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Note 2: The junction-to-ambient thermal resistance, Rth(j-a), should be kept below 25 ℃ /W so that the
TL12W02-D(T30) is not exposed to a condition beyond the absolute maximum ratings. Rth(j-a): Thermal
resistance from the LED junction to ambient temperature
IF – Ta
350
300
250
200
150
100
50 Rth(j-a)=25℃/W
0
0 20 40 60 80 100 120
Ambient temperature Ta (°C)
1 2008-07-14
Free Datasheet http://www.datasheet4u.com/
1 page  
TL12W02-D(T30)
Packaging
This LED device is packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture
absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before
soldering and they should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C to 30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the device should be assembled within 168 hours in an environment of
5°C to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 24 to 48 hours.
Expiration date: 12 months from sealing date, which is imprinted on the label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
• Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
(*)
240°C max
10 s max (*)
max(*)
140 to 160°C
(*)
4°C/s max
4°C/s max(*)
60 to 120 s max(*)
5 s max(*)
(*)
260°C max
4°C/s max(*)
max(*)
150 to 180°C 230°C
4°C/s max (*)
60 to 120 s max(*)
30 to 50 s max(*)
Time (s)
Time (s)
• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
• Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
• When any soldering corrections are made manually,a hot-plate should be used .
(only once at each soldering point)
Temperature of a hot plate: 150°C
Soldering iron:
25 W
Temperature:
350°C or less
Time:
within 3 s
• Do not perform wave soldering.
5 2008-07-14
5 Page | ||
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| PDF Descargar | [ Datasheet TL12W02-D.PDF ] | |
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