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S25FL129P Schematic ( PDF Datasheet ) - SPANSION

Teilenummer S25FL129P
Beschreibung 128-Mbit CMOS 3.0 Volt Flash Memory
Hersteller SPANSION
Logo SPANSION Logo 



Gesamt 30 Seiten
		
S25FL129P Datasheet, Funktion
S25FL129P
128-Mbit CMOS 3.0 Volt Flash Memory
with 104-MHz SPI (Serial Peripheral Interface) Multi I/O Bus
Data Sheet
S25FL129P Cover Sheet
This product is not recommended for new and current designs. For new and current designs,
S25FL128S supersedes S25FL129P. This is the factory-recommended migration path. Please refer to
the S25FL128S data sheet for specifications and ordering information.
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
Publication Number S25FL129P_00
Revision 08
Issue Date September 21, 2012
Free Datasheet http://www.datasheet4u.com/






S25FL129P Datasheet, Funktion
Data Sheet
13. Program Acceleration via W#/ACC Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
14. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
14.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
15. Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
16. DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
17. Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
18. AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
18.1 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
19. Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
19.1 SO3 016 — 16-pin Wide Plastic Small Outline Package (300-mil Body Width) . . . . . . . . . . 63
19.2 WSON 8-contact (6 x 8 mm) No-Lead Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
19.3 FAB024 — 24-ball Ball Grid Array (6 x 8 mm) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
19.4 FAC024 — 24-ball Ball Grid Array (6 x 8 mm) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
20. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
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S25FL129P
S25FL129P_00_08 September 21, 2012

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S25FL129P pdf, datenblatt
Data Sheet
5. Ordering Information
This product is not recommended for new and current designs. For new and current designs, S25FL128S
supersedes S25FL129P. This is the factory-recommended migration path. Please refer to the S25FL128S
data sheet for specifications and ordering information.
The ordering part number is formed by a valid combination of the following:
S25FL 129 P 0X M F I 00 1
Packing Type (Note 1)
0 = Tray
1 = Tube
3 = 13” Tape and Reel
Model Number (Additional Ordering Options)
31 = 6x4 pin configuration BGA package, Uniform 256 KB sectors
30 = 6x4 pin configuration BGA package, Uniform 64 KB sectors
21 = 5x5 pin configuration BGA package, Uniform 256 KB sectors
20 = 5x5 pin configuration BGA package, Uniform 64 KB sectors
01 = SO/WSON package, Uniform 256 KB sectors
00 = SO/WSON package, Uniform 64 KB sectors
Temperature Range
I = Industrial (–40°C to + 85°C)
V = Automotive In-Cabin (-40*C to + 105*C)
Package Materials
F = Lead (Pb)-free
H = Low-Halogen, Lead (Pb)-free
Package Type
M = 16-pin SO package
N = 8-contact WSON package
B = 24-ball BGA 6 x 8 mm package, 1.00 mm pitch
Speed
0X = 104 MHz
Device Technology
P = 0.09 µm MirrorBit® Process Technology
Density
129 = 128 Mbit
Device Family
S25FL
Spansion Memory 3.0 Volt-only, Serial Peripheral Interface (SPI) Flash Memory
5.1
Valid Combinations
Table 5.1 lists the valid combinations configurations planned to be supported in volume for this device.
Table 5.1 S25FL129P Valid Combinations Table
S25FL129P Valid Combinations
Base Ordering
Part Number
Speed Option
Package and
Temperature
Model
Number
S25FL129P
MFI, NFI
00
MFV , NFV
01
0X
BHI 20, 30
BHV
21, 31
Note
1. Package Marking omits the leading “S25” and speed, package and model number.
Packing Type Package Marking
0, 1, 3
FL129P + (Temp) + F
FL129P + (Temp) + FL
FL129P + (Temp) + F
0, 3
FL129P + (Temp) + FL
12
S25FL129P
S25FL129P_00_08 September 21, 2012

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