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PDF RT9996 Data sheet ( Hoja de datos )

Número de pieza RT9996
Descripción Power Management IC
Fabricantes Richtek Technology Corporation 
Logotipo Richtek Technology Corporation Logotipo



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No Preview Available ! RT9996 Hoja de datos, Descripción, Manual

RT9996
Power Management IC for SSD
General Description
The RT9996 is a 2-CH PMIC for SSD (Solid-State Drive).
It integrates synchronous buck converters and one voltage
detector.
The RT9996 provides 2 independent enable pins for
sequence control and auto discharge when powered off
on the power line of a NAND Flash.
The frequency can be up to 2MHz, allowing the use of
smaller sized inductors to meet the space and height limit
in handheld applications.
To maximize power utilization, the RT9996 is designed
with extremely low quiescent current. The buck converter
can consume down to 70μA when operating in standby
mode.
The RT9996 is available in a VQFN-32L 5x5 package.
Ordering Information
RT9996
Package Type
QV : VQFN-32L 5x5 (V-Type)
Note :
Lead Plating System
G : Green (Halogen Free and Pb Free)
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Features
z Supply Input Voltage Range : 2.8V to 5.5V
z Buck 1 / Buck 2
` Adjustable Output Voltage for VCORE or DRAM
Cache
` Output Current up to 1A
z Voltage Detector
` Programmable Threshold Voltage
` Open-Drain Reset Output
z RoHS Compliant and Halogen Free
Applications
z 1.8/2.5 inch Solid-State Drives
z Portable Devices
z USB-Based Hand-Held Products
Pin Configurations
(TOP VIEW)
http://www.DataSheet4U.net/
32 31 30 29 28 27 26 25
NC 1
NC 2
NC 3
NC 4
NC 5
VIN 6
NC 7
NC 8
GND
24 LX2
23 GND
22 GND
21 VIN
20 VIN
19 GND
33 18 GND
17 LX1
9 10 11 12 13 14 15 16
Marking Information
RT9996
GQV
YMDNN
RT9996GQV : Product Number
YMDNN : Date Code
VQFN-32L 5x5
DS9996-01 April 2011
www.richtek.com
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datasheet pdf - http://www.DataSheet4U.net/

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RT9996 pdf
RT9996
Parameter
Symbol
Test Conditions
Buck Converter 2
Quiescent Current
IQ No Load, No Switching
Shutdown Current
ISHDN
Feedback Reference Voltage VFB
EN = GND
Adjustable Output Voltage
VOUT
Output Voltage Line Regulation
Output Voltage Load
Regulation
UVLO Under voltage Lockout
threshold
VUVLO
VIN Rising
Hysteresis
EN2 Threshold Logic-High VIH
Voltage
Logic- Low VIL
Peak Current Limit
ILIM
Oscillator Frequency
Start-Up Time
P-MOSFET On-Resistance
N-MOSFET On-Resistance
Voltage Detector
fOSC
RD S(ON) _P
RD S(ON) _N
VIN = 3.6V, IOUT = 300mA
IOUT = 0mA Time from active EN to
90% of VOUT
VIN = VGS = 3.6V, PWM Mode
VIN = VGS = 3.6V, PWM Mode
Voltage Detection Threshold
Voltage Detection Delay Time
Thermal Protections
VIN Rising (L to H)
VIN Falling (H to L)
VD el ay (L to H )http://www.DataSheet4U.net/
VDelay (H to L)
Min Typ Max Unit
--
--
0.784
VFB
--
70
0.2
0.8
--
0.04
-- μA
-- μA
0.816 V
VIN0.2 V
-- %/V
-- 0.5
-- %/A
-- 2.1
-- 0.1
1.5 --
-- --
1.3 1.7
1.2 1.5
--
V
--
VIN V
0.4 V
-- A
1.8 MHz
-- 250 -- μs
-- 250
-- 260
-- mΩ
-- mΩ
0.693
0.673
70
5
0.7
0.68
100
10
0.707
0.687
130
20
V
ms
μs
Thermal Shutdown Threshold TSD
Thermal Shutdown Hysteresis ΔTSD
-- 160 -- °C
-- 25
-- °C
Note 1. Stresses listed as the above Absolute Maximum Ratingsmay cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. θJA is measured in natural convection at TA = 25°C on a high-effective thermal conductivity four-layer test board of
JEDEC 51-7 thermal measurement standard. The measurement case position of θJ is on the exposed pad of the
package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
DS9996-01 April 2011
www.richtek.com
5
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RT9996 arduino
RT9996
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX) TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
For recommended operating condition specifications of
the RT9996, the maximum junction temperature is 125°C
and TA is the ambient temperature. The junction to ambient
thermal resistance, θJA, is layout dependent. For VQFN-
32L 5x5 packages, the thermal resistance, θJA , is 36°C/
W on a standard JEDEC 51-7 four-layer thermal test board.
The maximum power dissipation at TA = 25°C can be
calculated by the following formula :
PD(MAX) = (125°C 25°C) / (36°C/W) = 2.778W for
VQFN-32L 5x5 package
The maximum power dissipation depends on the operating
ambient temperature for fixed TJ(MAX) and thermal
resistance, θJA . For the RT9996 package, the derating
curve in Figure 3 allows the designer to see the effect of
rising ambient temperature on the maximum power
dissipation.
3.0
Four-Layer PCB
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0.0
0
25 50 75 100
Ambient Temperature (°C)
125
Figure 3. Derating Curve for the RT9996 Package
Layout Considerations
Follow the PCB layout guidelines for optimal performance
of RT9996.
` Place the input capacitor as close as possible to the
device pins (VIN and GND).
` LX node is with high frequency voltage swing and should
be kept in a small area.
` Connect feedback network behind the output capacitors.
` Keep the switching area small. Place the feedback
components near the RT9996.
` Connect all analog grounds to a common node and then
connect the common node to the power ground behind
the output capacitors.
http://www.DataSheet4U.net/
DS9996-01 April 2011
www.richtek.com
11
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