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PDF TLWLK1109 Data sheet ( Hoja de datos )
| Número de pieza | TLWLK1109 | |
| Descripción | LED Lamp | |
| Fabricantes | Toshiba | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TLWLK1109 (archivo pdf) en la parte inferior de esta página. Total 10 Páginas | ||
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TLWLK1109(T11)
TOSHIBA LED Lamp
TLWLK1109(T11)
Panel Circuit Indicators
Unit: mm
• Surface-mount devices
• 3.2 (L) × 2.9 (W) × 1.9 (H) mm
• LED chip and phosphor
• Luminous intensity: Iv = 2500 mcd (typ.) @40 mA
• Color: white (Warm White)
• Topr / Tstg = -40 to 100°C
• Applications: automotive use, backlighting etc.
• Standard embossed tape packing: T11 (2000 pcs/reel)
8-mm tape reel
Color and Material
Part Number
Color
Material
TLWLK1109
White(Warm White)
InGaN
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
JEDEC
―
JEITA
―
TOSHIBA
4-3W1
Weight: 0.035 g (typ.)
Unit
Forward Current
(Note 1)
IF
50
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mA
Power Dissipation
PD 200 mW
Operating Temperature
Topr
−40 to 100
°C
Storage Temperature
Tstg
−40 to 100
°C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
80
IF – Ta
60
40
20
0
0 20 40 60 80 100 120
Ambient temperature Ta (°C)
For part availability and ordering information please call Toll Free: 800.984.5337
Website: www.marktechopto.com | Email: [email protected]
2009-10-13
datasheet pdf - http://www.DataSheet4U.net/
1 page  
TLWLK1109(T11)
Packaging
This LED device is packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture
absorption. The optical characteristics of the device may be affected by exposure to moisture in the air before
soldering and the device should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C to 30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the device should be assembled within 4week in an environment of 5°C
to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the device should be baked in taping with reel.
After baking, use the baked device within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 24 to 48 hours.
Expiration date: 12 months from sealing date, which is imprinted on the label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
• Reflow soldering (example)
Temperature profile for Pb soldering (example)
Temperature profile for Pb-free soldering (example)
(*)
240°C max
10 s max (*)
140~160°C max(*)
(*)
4°C/s max
4°C/s max(*)
60~120 s max(*)
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5 s max(*)
(*)
260°C max
4°C/s max(*)
max(*)
150~180°C 230°C
4°C/s max(*)
60~120 smax(*)
Time (s)
30~50s max(*)
Time (s)
• The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than max(*) values) as a evaluation. Please perform reflow soldering under
the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 4week of
opening the package.
• Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
• Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron: 25 W
Temperature : 300°C or less
Time
: within 3 s
• Do not perform wave soldering.
5 2009-10-13
datasheet pdf - http://www.DataSheet4U.net/
5 Page | ||
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| PDF Descargar | [ Datasheet TLWLK1109.PDF ] | |
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