|
|
Número de pieza | VESD05C-FC1 | |
Descripción | Flip Chip Protection Diode | |
Fabricantes | Vishay | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de VESD05C-FC1 (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
No Preview Available ! www.DataSheet.co.kr
VISHAY
VESD05C-FC1
Vishay Semiconductors
Flip Chip Protection Diode - Chip Size 0402
Description
Flip Chip is a chip with all packaging and interconnec-
tions manufactured on the wafer prior to dicing. The
interconnections are made of solder bumps on i/o
pads.Our device utilizes a silicon P/N junction for
excellent clamping (protection) performance with low
leakage current characteristic.
Features
• ESD protection to IEC 61000-4-2 30 kV (air)
• ESD protection to IEC 61000-4-2 8 kV (contact)
12
19120
• ESD protection to IEC 61000-4-5
(lightning): 8/20 µs, IPPM = 10 mA
• 120 W peak pulse power dissipation per line
(8/20 µs)
• Suitable for high frequency applications
(low capacitance, low parasitic inductance)
• Low clamping voltage
• Minimum PCB space needed (0.5 mm2),
< 0.55 mm height, only 0.47 mg/pcs
• No need for underfill material and/or additional
solder
• Can be assembled using standard SMT pick &
place equipment, reflow processes per J-STD-020
and assembly methods
• Green product
Applications
Cellular phones
Personal digital assistants (PDA), notebook
computers
MP3 players
GPS
Digital cameras
Bluetooth
Audio amplifiers
DVD
Power management systems
Read write heads for hard drives
Modules for watches
CPU
Digital TV’s and sattelites receivers
SMART cards
Mechanical Data
Case: Flip Chip 1005
Standard EIA chip size: 0402
8 mm tape and reel per EIA-481-1-A/IEC60286
Top contacts: 4 solder bumps 100 µm in height
(nominal)
Bumps of SnAgCu (lead-free)1)
1) also available with PbSn bumps
Document Number 85859
Rev. 1.1, 14-Jul-04
www.vishay.com
1
Datasheet pdf - http://www.DataSheet4U.net/
1 page www.DataSheet.co.kr
VISHAY
VESD05C-FC1
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and
operatingsystems with respect to their impact on the health and safety of our employees and the public, as
well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the
use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
Document Number 85859
Rev. 1.1, 14-Jul-04
www.vishay.com
5
Datasheet pdf - http://www.DataSheet4U.net/
5 Page |
Páginas | Total 5 Páginas | |
PDF Descargar | [ Datasheet VESD05C-FC1.PDF ] |
Número de pieza | Descripción | Fabricantes |
VESD05C-FC1 | Flip Chip Protection Diode - Chip Size 0402 | Vishay Siliconix |
VESD05C-FC1 | Flip Chip Protection Diode | Vishay |
Número de pieza | Descripción | Fabricantes |
SLA6805M | High Voltage 3 phase Motor Driver IC. |
Sanken |
SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
Analog Devices |
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |