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IDD03SG60C Schematic ( PDF Datasheet ) - Infineon Technologies

Teilenummer IDD03SG60C
Beschreibung Schottky Diode
Hersteller Infineon Technologies
Logo Infineon Technologies Logo 




Gesamt 7 Seiten
IDD03SG60C Datasheet, Funktion
3rd Generation thinQ!TM SiC Schottky Diode
Features
• Revolutionary semiconductor material - Silicon Carbide
• Switching behavior benchmark
• No reverse recovery / No forward recovery
• Temperature independent switching behavior
• High surge current capability
• Pb-free lead plating; RoHS compliant
• Qualified according to JEDEC1) for target applications
• Breakdown voltage tested at 20mA2)
• Optimized for high temperature operation
• Lowest Figure of Merit QC/IF
Product Summary
VDC
QC
IF; TC< 130 °C
thinQ! 3G Diode designed for fast switching applications like:
• SMPS e.g.; CCM PFC
• Motor Drives; Solar Applications; UPS
IDD03SG60C
600 V
3.2 nC
3A
Type
IDD03SG60C
Package
PG-TO252-3
Marking
D03G60C
Pin 1
n.c.
Pin 2
A
Pin 3
C
Maximum ratings
Parameter
Symbol Conditions
Continuous forward current
I F T C<130 °C
Surge non-repetitive forward current, I F,SM
sine halfwave
T C=25 °C, t p=10 ms
T C=150 °C, t p=10 ms
Non-repetitive peak forward current
i ²t value
I F,max
i 2dt
T C=25 °C, t p=10 µs
T C=25 °C, t p=10 ms
T C=150 °C, t p=10 ms
Repetitive peak reverse voltage
Diode dv/dt ruggedness
V RRM
dv/ dt
T j=25 °C
VR= 0….480 V
Power dissipation
P tot T C=25 °C
Operating and storage temperature
Soldering temperature, reflow
soldering (max)
T j, T stg
T sold
reflow MSL1
Value
3
11.5
9.7
100
0.61
0.44
600
50
38
-55 ... 175
260
Unit
A
A2s
V
V/ns
W
°C
Rev. 2.4
page 1
2013-02-11






IDD03SG60C Datasheet, Funktion
PG-TO252-3: Outline
IDD03SG60C
Soldering temperature, reflow soldering (max)
Dimensions in mm/inches
Rev. 2.4
page 6
2013-02-11

6 Page







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