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PDF JSL Data sheet ( Hoja de datos )
| Número de pieza | JSL | |
| Descripción | POWER RELAY | |
| Fabricantes | Fujitsu | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de JSL (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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FTR-K1 SERIES
POWER RELAY
1 POLE - 8A Polarized Latching Type
JSL Series
n FEATURES
l Small footprint
- Width: 10mm
- Height: 12.5mm
l High insulation
- Insulation distance: 8 mm (between coil and contacts)
- Dielectric strength: 5,000 VAC (between coil and contacts)
- Surge strength: 10,000 V (between coil and contacts)
l Plastic materials
- UL 94 flame class V-0
l Plastic sealed type
l Cadmium free relay
l Lead-free relay
l RoHS compliant.
Please see page 5 for more information
n PARTNUMBER INFORMATION
JS L D 12 M N - K
[Example]
(a) (b) (c) (d) (e) (f ) (g)
(a)
(b)
(c)
(d)
e)
(f)
Relay type
�O�p�e�r�a�t�i�ng�� �f�u�n�c�t�i�on��
�Co��il��t�y�p��e�
Coil rated voltage
Contact configuration
Contact material
(g) Sealed type
JS : JS Series
�L� �: �L�a��t�c�h�i�ng�� �ty��p�e��
N�i�l �����: �1 �c�oi�l�
D : 2 coils
12 : 3.....24 VDC
Coil rating table at page 3
Nil : 1 form C
M : 1 form A
N : AgSnO2 , Au plated
K : Wash tight
www.DataSheet4U.net
1 page  
FTJRS-KL1SSEERRIIEESS
RoHS Compliance and Lead Free Information
1. General Information
l All signal and power relays produced by Fujitsu Components are compliant with RoHS directive 2002/95EC
including amendments.
l Cadmium as used in electrical contacts is exempted from the RoHS directives on October 21st, 2005.
(Amendment to Directive 2002/95/EC)
l All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info for older date codes
at: http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf
l Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified.
This material has been verified to be compatible with PbSn assembly process.
2. Recommended Lead Free Solder Profile
l Recommended solder Sn-3.0Ag-0.5Cu.
Flow Solder condition:
Pre-heating: maximum 120˚C
Soldering: dip within 5 sec. at
260˚C solder bath
Solder by Soldering Iron:
Soldering Iron
Temperature: maximum 360˚C
Duration:
maximum 3 sec.
We highly recommend that you confirm your actual solder conditions
3. Moisture Sensitivity
l Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.
4. Tin Whiskers
l Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable length
whisker was found by our in house test.
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet JSL.PDF ] | |
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