(PDF) MB1608600Y5x Datasheet - MULTILAYER CHIP BEAD

Número de pieza	MB1608600Y5x
Descripción	MULTILAYER CHIP BEAD
Fabricantes	ABC Taiwan Electronics
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No Preview Available ! SPECIFICATION FOR APPROVAL REF : PROD. NAME MULTILAYER CHIP BEAD ABC'S DWG NO. ABC'S ITEM NO. MB1608□□□□5□ CONFIGURATION & DIMENSIONS PAGE: 1 A DD B Series MB1608 A 1.60±0.15 B 0.80±0.15 SCHEMATIC DIAGRAM C 0.80±0.15 IGI PCB Pattern Unit : m/m D GHI 0.30±0.20 0.7 0.7 0.7 MATERIALS a Body Ferrite b Internal conductor Silver or Ag / Pd c Terminal electrode Ag/Ni/Sn (Lead contant 100ppm max.) d Remark Lead content 1600ppm typ. include ferrite a bc GENERAL SPECIFICATION a Storage temp. -40 ---- +105 b Operating temp. -25 ---- +85 c Terminal Strength F Type F ( kgf ) time ( sec ) MB1608 0.5 30±5 d Solderability Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5 Flux : Rosin Dip time : 4±1 seconds AE-001A Peak Temp 260 max. Max time above 230 50sec max. Max time above 200 70sec max. Temperature Rising Area Preheat Area +4.0 / sec max. 150 ~ 200 / 60 ~ 120sec 250 200 Reflow Area +2.0 ~ 4.0 / sec max. Forced Cooling Area -(1.0 ~ 5.0) / sec max. Peak Temperature: 260 50sec max. 230 150 70sec max. 100 50 0 50 100 150 200 250 Time ( seconds ) 1 page

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PDF MB1608600Y5x Data sheet ( Hoja de datos )