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GL100MN1MP1 Schematic ( PDF Datasheet ) - Sharp Electrionic Components

Teilenummer GL100MN1MP1
Beschreibung High Power Output Infrared Emitting Diode
Hersteller Sharp Electrionic Components
Logo Sharp Electrionic Components Logo 




Gesamt 11 Seiten
GL100MN1MP1 Datasheet, Funktion
GL100MN1MPx
GL100MN1MPx Surface Mount Type, High Power
Output Infrared Emitting Diode
Features
1. Compact and thin SMD package
2. Top view and side view mountable
3. Plastic mold with resin lens
4. Peak emission wavelength: 940 nm TYP.
5. Narrow directivity angle (Δθ ±10° TYP.)
6. High power output (φ e: 6.0 mW MAX.)
7. Lead free and RoHS directive compliant
Model Line-up
Model No.
GL100MN1MP
GL100MN1MP1
Packaging
2000 pcs/reel
1500 pcs/reel
Mount Direction
Side view
Top view
Agency Approvals/Compliance
1. Compliant with RoHS directive (2002/95/EC)
2. Content information about the six substances
specified in “Management Methods for Control of
Pollution Caused by Electronic Information Prod-
ucts Regulation” (popular name: China RoHS)
(Chinese:
);
refer to page 7.
Applications
1. Office automation equipment
2. Audio visual equipment
3. Home appliances
4. Telecommunication equipment
5. Measuring equipment
6. Tooling machines
7. Computers
www.DataSheet4U.com
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1 Sheet No.: D1-A00701EN
Date: November 30, 2007
©SHARP Corporation






GL100MN1MP1 Datasheet, Funktion
GL100MN1MPx
Design Considerations
Design Guidelines
1. Allow for natural degradation of the LED as a result of long continuous operation. This part will have 50% deg-
radation in output after 5 years of continuous use.
2. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
Manufacturing Guidelines
Soldering Instructions
1. Sharp recommends soldering no more than once when using solder reflow methods.
2. When using solder reflow methods, follow the reflow soldering temperature profile shown in Fig. 10. Sharp rec-
ommends checking the process to make sure these parameters are not exceeded; exceeding these parameters
can cause substrate bending or other mechanical stresses leading to debonding of the internal gold wires, or
other similar failure modes.
3. If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the
part's resin. Be sure to keep the temperature profile within the guidelines shown in Fig. 10.
4. If hand soldering, use temperatures 260° for 3 seconds. Do not dip-solder or VPS-solder this part.
5. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
Fig. 10 Reflow Soldering Temperature Profile
240°C MAX.
200°C
165°C MAX.
1 ~ 4°C/s
1 ~ 4°C/s
1 ~ 4°C/s
25°C
120s MAX.
90s MAX.
10s MAX.
60s MAX.
Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
www.D2.ataSShoelvete4nUt.ccolemaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-
tions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Sheet No.: D1-A00701EN
6

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