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PDF SMV0402ExxxxxxRR Data sheet ( Hoja de datos )
| Número de pieza | SMV0402ExxxxxxRR | |
| Descripción | Zinc Oxide | |
| Fabricantes | Ceramate Technical | |
| Logotipo |  |
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CITATION
SUBJECT
TYPE SMV0402E□□□□□□□□RR MODEL
Structure
DATE
REV.
PAGE 1/9
Feb. 13, 2009
C01
1. STRUCTURE
NO. ITEM
DESCRIPTION
1.1 Main Material Zinc Oxide
1.2 End termination Ag/Ni/Sn
1.3
Packaging
Reel
1.4
Complies with
Standard
IEC61000-4-2 level 4
1.5
Complies with RoHS
Standard
Yes
1.6 Lead content < 1000ppm
Reflow solder profile
1.7
temperature
250 ℃
(Recommend)
L
W
T(max.)
1.8 Dimensions
a
1.00 ± 0.10
0.50 ± 0.10
0.60
0.25 ± 0.1
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1 page  
CITATION
SUBJECT
TYPE SMV0402E□□□□□□□□RR MODEL
Soldering
DATE
REV.
PAGE 5/9
Feb. 13, 2009
C01
5. SOLDERING RECOMMENDATIONS
5.1 Recommended solder pad layout
A B CD
0.4~0.6 1.4~1.8 0.5~0.6 0.6~1.2
（Unit：mm）
5.2 The SIR test of the solder paste shall be done（Based on JIS-Z-3284）
5.3 Steel plate and foot distance printing
Foot distance printing (mm)
> 0.65mm
0.65mm~0.5mm
0.50mm~0.40mm
<=0.40 mm
Steel Plate thickness (mm)
0.18mm
0.15mm
0.12mm
0.10mm
5.4 IR Soldering
Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and
gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and
solder liquids times. Make sure that the element is not 2.4 The IR reflow and temperature of Soldering for Pb
Free subjected to a thermal gradient steeper than 4 degrees per second. 2 degrees per second is the ideal
gradient. During the soldering process, pre- heating to within 100 degrees of the solders peak temperature is
essential to minimize thermal shock.
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| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet SMV0402ExxxxxxRR.PDF ] | |
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