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PDF APTC60HM45SCTG Data sheet ( Hoja de datos )

Número de pieza APTC60HM45SCTG
Descripción Full - Bridge Series & SiC parallel diodes Super Junction MOSFET Power Module
Fabricantes Microsemi 
Logotipo Microsemi Logotipo



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APTC60HM45SCTG
Full - Bridge
Series & SiC parallel diodes
Super Junction
MOSFET Power Module
CR1A
VBUS
CR3A
VDSS = 600V
RDSon = 45mΩ max @ Tj = 25°C
ID = 49A @ Tc = 25°C
Application
Motor control
Switched Mode Power Supplies
Uninterruptible Power Supplies
Q1 CR1B CR3B
Q3
Features
G1
S1
G2
S2
NTC1
CR2A
OUT1 OUT2
CR4A
Q2 CR2B CR4B
Q4
0/VBUS
G3
S3
G4
S4
NTC2
- Ultra low RDSon
- Low Miller capacitance
- Ultra low gate charge
- Avalanche energy rated
Parallel SiC Schottky Diode
- Zero reverse recovery
- Zero forward recovery
- Temperature Independent switching behavior
- Positive temperature coefficient on VF
Kelvin source for easy drive
Very low stray inductance
- Symmetrical design
- Lead frames for power connections
G3
S3
VBUS
G4
S4
0/VBUS
OUT2
OUT1
Internal thermistor for temperature monitoring
High level of integration
Benefits
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
S1 S2 NTC2
G1 G2 NTC1
Solderable terminals both for power and signal for
easy PCB mounting
Low profile
Absolute maximum ratings
RoHS compliant
Symbol
Parameter
Max ratings Unit
VDSS
ID
IDM
VGS
RDSon
Drain - Source Breakdown Voltage
Continuous Drain Current
Pulsed Drain current
Gate - Source Voltage
Drain - Source ON Resistance
Tc = 25°C
Tc = 80°C
600 V
49
38 A
130
±20 V
45 mΩ
www.DataPSDheet4UM.caoxmimum Power Dissipation
Tc = 25°C
250
W
IAR Avalanche current (repetitive and non repetitive)
EAR Repetitive Avalanche Energy
EAS Single Pulse Avalanche Energy
15
3
1900
A
mJ
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
www.microsemi.com
1–8

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APTC60HM45SCTG pdf
APTC60HM45SCTG
Typical CoolMOS Performance Curve
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.6
0.5 0.9
0.4 0.7
0.3 0.5
0.2 0.3
0.1 0.1
0.05
0
0.00001
0.0001
Single Pulse
0.001
0.01
0.1
rectangular Pulse Duration (Seconds)
1
10
Low Voltage Output Characteristics
360
320 VGS=15&10V
280
240
6.5V
6V
200 5.5V
160
120
80
40
0
0
5V
4.5V
4V
5 10 15 20 25
VDS, Drain to Source Voltage (V)
1.3
1.25
1.2
RDS(on) vs Drain Current
Normalized to
VGS=10V @ 50A
VGS=10V
1.15
1.1
1.05
VGS=20V
1
0.95
0.9
0 20 40 60 80 100 120 140
ID, Drain Current (A)
www.DataSheet4U.com
Transfert Characteristics
140
120
VDS > ID(on)xRDS(on)MAX
250µs pulse test @ < 0.5 duty cycle
100
80
60
40 TJ=125°C
20
TJ=25°C
TJ=-55°C
0
0123456
VGS, Gate to Source Voltage (V)
7
DC Drain Current vs Case Temperature
50
45
40
35
30
25
20
15
10
5
0
25 50 75 100 125 150
TC, Case Temperature (°C)
www.microsemi.com
5–8

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