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CP160808T-201x Schematic ( PDF Datasheet ) - TaeJin

Teilenummer CP160808T-201x
Beschreibung Multilayer Chip Beads
Hersteller TaeJin
Logo TaeJin Logo 




Gesamt 30 Seiten
CP160808T-201x Datasheet, Funktion
Multilayer Chip Beads / CP TYPELarge Current
.Features:
1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk.
2.Extremely high reliability due to entirely monolithic construction.
3.Low DC resistance structure of electrode to prevent wasteful electric power consumption.
4.Hing Current rating up to 6A.
5.The products contain no lead and also support lead-free soldering.
.Applications:
CP type has a large current funtion for power line due to its low DC resistance, it can generate an impedance
down to relative low frequency and cover a wide range of noise suppression.
.Product Identification
PIHD □□□□ □ □□□ □
Tolerance
Inductance
.Shape and Dimension
.Schematic
Dimensions in mm
TYPE
A(mm)
CP160808
1.6±0.2
CP201209
2.0±0.2
CP321611
3.2±0.2
CP451616
4.5±0.2
CP453215
4.5±0.2
.Recommended Reflow
B(mm)
0.8±0.2
1.2±0.2
1.6±0.2
1.6±0.2
3.2±0.2
C(mm)
0.8±0.2
0.9±0.2
1.1±0.2
1.6±0.2
1.5±0.2
D(mm)
0.3±0.2
0.5±0.3
0.5±0.3
0.5±0.3
0.5±0.3
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CP160808T-201x Datasheet, Funktion
Multilayer Chip Beads / CP TYPELarge Current
. Reliability and Test Conditions(可靠性測試條件)
1-1.Mechanical Performance
Item
Specification
Test Method
Flexure Strength
The forces applied on the right Test device shall be soldered on the substrate
conditions must not damage
Substrate Dimension: 100x40x1.6mm
the terminal electrode and the Deflection: 2.0mm
ferrite
Keeping Time: 30sec
*For 100505, substrate dimension is 100x40x0.8mm
Vibration
Test device shall be soldered on the substrate
Oscillation Frequency: 10 to 55 to 10Hz for 1min
Amplitude: 1.5mm
Time: 2hrs for each axis (X, Y & Z), total 6hrs
Resistance to Soldering Heat Appearance: No damage
Pre-heating: 150, 1min
More than 75% of the terminal Solder Composition: Sn/Pb = 63/37
electrode should be covered
Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)
with solder. Impedance :
Solder Temperature: 260±5
within ±30% of initial value
Immersion Time: 10±1sec
Solder ability
The electrodes shall be at
Pre-heating: 150, 1min
least 90% covered with new
Solder Composition: Sn/Pb = 63/37
solder coating
Solder Temperature: 220±5
Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)
Solder Temperature: 245±5(Pb-Free)
Immersion Time: 4±1sec
Terminal Strength Test
100505 series : 0.2 kg
Test device shall be soldered on the substrate
160808 series : 0.5 kg
201209 series : 1.0 kg
other series : 2.0 kg
BAY/BAQ321609 series:1.5 kg
(Push)
Item
Temperature Cycle
Humidity Resistance
High
Temperature Resistance
Low
Temperature Resistance
Specification
Appearance: No damage
Impedance: within±30% of
initial value
Test Method
One cycle:
Step Temperature () Time (min)
1 -55±3
30
2 25±2
3
3 125±3
30
4 25±2
3
Total: 100cycles
Measured after exposure in the room condition for 24hrs
Temperature: 40±2
Relative Humidity: 90 ~ 95% / Time: 1000hrs
Measured after exposure in the room condition for 24hrs
Temperature: 125±3/ Relative Humidity: 0%
Applied Current: Rated Current /Time: 1000hrs
Measured after exposure in the room condition for 24hrs
Temperature: -55±3
Relative Humidity: 0% / Time: 1000hrs
Measured after exposure in the room condition for 24hrs
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CP160808T-201x pdf, datenblatt
Multilayer Chip Beads / CB TYPE
Electrical CharacteristicsCB451616 TYPE
Part No.
IMPEDANCE
(±25%)
Test frequency
CB451616T-500
50
100 MHZ,200 mV
CB451616T-600
60
100 MHZ,200 mV
CB451616T-800
80
100 MHZ,200 mV
CB451616T-900
90
100 MHZ,200 mV
CB451616T-101
100
100 MHZ,200 mV
DCR
() Max
0.2
0.2
0.2
0.3
0.3
Rated Current
(mA) Max
600
600
600
500
500
NOTE:
1. Operating temperature range 55℃~125
2. Rate Current : Applied the current to coils, the temperature rise shall not be more than 30
3. ToleranceJ=5%;K=10%;M=20%;Y=25%;N=30
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