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PDF CXG1210UR Data sheet ( Hoja de datos )
| Número de pieza | CXG1210UR | |
| Descripción | High Power 3P3T Switch | |
| Fabricantes | Sony | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de CXG1210UR (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
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High Power 3P3T Switch with Logic Control
www.DataSheet4U.com
CXG1210UR
Description
This IC can be used in wireless communication systems, for example, CDMA EV-DO handsets.
The IC has on-chip logic for operation with 3 CMOS control inputs.
The Sony JPHEMT process is used for low insertion loss and on-chip logic circuit.
(Applications: Antenna switch for cellular handsets, CDMA, EVDO)
Features
Low insertion loss: 0.3dB@900MHz
3 CMOS compatible control line
Package
Small package size: 20-pin UQFN
Structure
GaAs JPHEMT MMIC
Absolute Maximum Ratings
(Ta = 25°C)
Bias voltage
Control voltage
Operating temperature
Storage temperature
RF input power
VDD
7
Vctl 5
Topr –35 to +85
Tstg –60 to +150
Pin = 37dBm
V
V
°C
°C
This IC is ESD sensitive device. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
-1-
E05517
1 page  
Package Outline
(Unit: mm)
CXG1210UR
www.DataSheet4U.com
20PIN UQFN (PLASTIC)
0.55 ± 0.05
2.7
15
16
11
10
x4
0.1 S A-B C
0.4 ± 0.1
1.3
C
4-R0.3
AB
20
1
6
5
PIN 1 INDEX
0.26
0.18
0.4
0.07
0.25
0.05 M S A-B C
S
Solder Plating
+ 0.09
0.14 – 0.03
0.05 S
+ 0.09
0.25 – 0.03
S
TERMINAL SECTION
Note:Cutting burr of lead are 0.05mm MAX.
SONY CODE
EIAJ CODE
JEDEC CODE
UQFN-20P-01
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.02g
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SPEC.
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18µm
-5-
Sony Corporation
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet CXG1210UR.PDF ] | |
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