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PDF CXG1172UR Data sheet ( Hoja de datos )

Número de pieza CXG1172UR
Descripción JPHEMT High Power DPDT Switch with Logic Control
Fabricantes Sony 
Logotipo Sony Logotipo



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No Preview Available ! CXG1172UR Hoja de datos, Descripción, Manual

CXG1172URwww.DataSheet4U.com
JPHEMT High Power DPDT Switch with Logic Control
Description
The CXG1172UR can be used in wireless com-
munication systems, for example, CDMA handsets,
W-CDMA handsets.
The IC has on-chip logic for operation with 1 CMOS
control input.
The Sony JPHEMT process is used for low insertion
loss and on-chip logic circuit.
Features
Low insertion loss: 0.3dB@900MHz, 0.45dB@2GHz
1 CMOS compatible control line
Small package size: 12-pin UQFN
Applications
Antenna switch for cellular handsets
W-CDMA, CDMA
Structure
GaAs JPHEMT MMIC
Absolute Maximum Ratings (Ta = 25°C)
Bias voltage
VDD
7
Control voltage
Vctl 5
Operating temperature Topr –35 to +85
Storage temperature Tstg –65 to +150
V
V
°C
°C
12 pin UQFN (Plastic)
GaAs MMICs are ESD sensitive devices. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E04522-PS

1 page




CXG1172UR pdf
Package Outline
Unit: mm
CXG1172UR
www.DataSheet4U.com
12PIN UQFN (PLASTIC)
2.0 0.55 ± 0.05
9
10
7
6
x4
0.1 S A-B C
0.4 ± 0.1
0.6
4-R0.2
C
AB
12
1
4
3
PIN 1 INDEX
0.26
0.18
0.4
0.07
0.25
0.05 M S A-B C
S
Solder Plating
+ 0.09
0.14 – 0.03
0.05 S
+ 0.09
0.25 – 0.03
S
TERMINAL SECTION
Note:Cutting burr of lead are 0.05mm MAX.
SONY CODE
EIAJ CODE
JEDEC CODE
UQFN-12P-01
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.01g
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SPEC.
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18µm
–5–
Sony Corporation

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