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WC32P020-XXM Schematic ( PDF Datasheet ) - White Electronic Designs Corporation

Teilenummer WC32P020-XXM
Beschreibung 16 32-Bit General-Purpose Data and Address Registers
Hersteller White Electronic Designs Corporation
Logo White Electronic Designs Corporation Logo 




Gesamt 14 Seiten
WC32P020-XXM Datasheet, Funktion
White Electronic Designs
WC32P020-XXM
www.DataSheet4U.com
68020 FEATURES
Selection of Processor Speeds: 16.67, 20, 25 MHz
Military Temperature Range: -55°C to +125°C
Packaging
•114 pin Ceramic PGA (P2)
•132 lead Ceramic Quad Flatpack, CQFP (Q2)
Object-code compatible with earlier 68000
Microprocessors
Addressing mode extensions for enhanced support
of high-level languages
Bit Field Data Type Accelerates Bit-Oriented
Applications–i.e., Video Graphics
Fast On-Chip Instruction Cache Speeds
Instructions and Improves Bus Bandwidth
Coprocessor Interface to Companion 32-Bit
Peripherals–the 68881 and 68882 Floating-Point
Coprocessors and the 68851 Paged Memory
Management Unit
Pipelined Architecture with High Degree of Internal
Parallelism allowing Multiple Instructions to be
executed concurrently
High-Performance Asynchronous Bus Is
Nonmultiplexed and Full 32-Bits
Dynamic Bus Sizing Efficiently Supports 8-/16-/32-
Bit Memories and Peripherals
Full Support of Virtual Memory and Virtual Machine
16 32-Bit General-Purpose Data and Address
Registers
Two 32-Bit Supervisor Stack Pointers and Five
Special-Purpose Control Registers
18 Addressing Modes and 7 Data Types
4 GigaByte Direct Addressing Range
DESCRIPTION
The WC32P020 is a 32-bit implementation of the 68000
Family of microprocessors. Using HCMOS technology,
the WC32P020 is implemented with 32-bit registers and
data paths, 32-bit addresses, a powerful instruction set,
and flexible addressing modes.
FIGURE 1 – BLOCK DIAGRAM
MICRO MACHINE
MICROROM
NANOROM
CONTROL SECTION
SEQUENCER
INSTRUCTION DECODE
INSTRUCTION PIPE
TAG
CACHE
EXECUTION UNIT
INSTRUCTION OPERAND
ADDRESS ADDRESS
SECTION SECTION
DATA
SECTION
INSTRUCTION
CACHE
ADDRESS
PADS
BUS
CONTROLLER
DATA
PADS
BUS CONTROLLER
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
December 2002
Rev. 2
1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com






WC32P020-XXM Datasheet, Funktion
White Electronic Designs
WC32P020-XXM
www.DataSheet4U.com
MAXIMUM RATINGS
Symbol
VCC
VI
PDMAX
TCASE
TCASE
TSTG
TJ
Parameter
Supply voltage
Input voltage
Max Power dissipation
Operating temperature (Mil.)
Operating temperature (Ind.)
Storage temperature
Junction temperature
Min
-0.3
-0.3
-55
-40
-55
Max
+7.0
+7.0
2.0
+125
+85
+150
+160
Unit
V
V
W
°C
°C
°C
°C
Thermal Characteristics
(with no heat sink or airflow)
Characteristic
Symbol Value Rating
Thermal Resistance — Junction to Ambient
PGA Package
CQFP Package
θJA °C/W
26
46
Thermal Resistance — Junction to Case
PGA Package
CQFP Package
θJC °C/W
3
15
POWER CONSIDERATIONS
The average chip junction temperature, TJ, in °C can be
obtained from:
TJ = TA + (PD • θJA)
(1)
where:
TA = Ambient Temperature, °C
qJA = Package Thermal Resistance, Junction-to-
Ambient, °C/W
PD = PINT+PI/O
PINT = ICC x VCC, Watts-Chip Internal Power
PI/O = Power Dissipation on Input and Output
Pins-User Determined
For most applications, PI/O < PlNT and can be neglected.
The following is an approximate relationship between PD
and TJ (if PI/O is neglected ):
PD = KÞ(TJ + 273°C)
(2)
θJC is device related and cannot be influenced by the user.
However, θCA is user dependent and can be minimized
by such thermal management techniques as heat sinks,
ambient air cooling, and thermal convection. Thus,
good thermal management on the part of the user can
significantly reduce θCA so that θJA approximately equals
θJC. Substitution of θJC for θJA in equation (1) will result in
a lower semiconductor junction temperature.
Solving equations (1) and (2) for K gives:
K = PD • (TA + 273°C) + qJA • PD2
(3)
where K is a constant pertaining to the particular part. K
can be determined from equation (3) by measuring PD
(at equilibrium) for a known TA. Using this value of K, the
values of PD and TJ can be obtained by solving equations
(1) and (2) iteratively for any value of TA.
The total thermal resistance of a package (θJA) can be
separated into two components, θJC and θCA, representing
the barrier to heat flow from the semiconductor junction
to the package (case) surface (θJC) and from the case to
the outside ambient (qCA). These terms are related by the
equation:
θJA = θJC + θCA
(4)
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
December 2002
Rev. 2
6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

6 Page









WC32P020-XXM pdf, datenblatt
White Electronic Designs
WC32P020-XXM
www.DataSheet4U.com
FIGURE 8 – BUS ARBITRATION TIMING DIAGRAM
S0 S1 S2 S3 S4 S5
CLK
A31-A0
D31-D0
FC2-FC0
SIZ1-SIZ0
ECS#
OCS#
7
AS#
DS#
R/W#
DBEN
DSACK0#
16
DSACK1#
BR#
BG#
BGACK#
35
39
33
34
37
39A
NOTE: Timing measurements are referenced to and from a low 0.8V and a high voltage of 2.0V, unless otherwise noted. The voltage swing
through this range should start outside and pass through the range such that the rise or fall will be linear between 0.8V and 2.0V.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
December 2002
Rev. 2
12 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

12 Page





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