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PDF ESDA6V1M6 Data sheet ( Hoja de datos )

Número de pieza ESDA6V1M6
Descripción 4- and 5-line Transil arrays
Fabricantes STMicroelectronics 
Logotipo STMicroelectronics Logotipo



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ESDA6V1M6, ESDA6V1-5M6
4- and 5-line Transil™ arrays for ESD protection
Features
High ESD protection level
High integration
Suitable for high density boards
4 unidirectional Transil diodes
(ESDA6V1M6)
5 unidirectional Transil diodes
(ESDA6V1-5M6)
Breakdown Voltage VBR = 6.1 V min
High peak power dissipation:
100 Watts 8/20 µs
Low leakage current < 500 nA
Low diode capacitance (70 pF typ at 0 V)
Very small PCB area: 1.45 mm²
500 microns pitch
Lead-free package
Complies with the following standards:
IEC 61000-4-2
– 15 kV (air discharge)
– 8 kV (contact discharge)
www.DataSheeMt4IUL.cSomTD 883G- Method 3015-7: class 3B
– > 8 kV (human body model)
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
Computers
Printers
Communication systems
Cellular phone handsets and accessories
Video equipment
Micro QFN package
Figure 1. Functional diagram
ESDA6V1M6
I/O1 1
GND 2
I/O2 3
6 I/O5
5 GND
4 I/O3
ESDA6V1-5M6
I/O1 1
GND 2
I/O2 3
6 I/O5
5 I/O4
4 I/O3
Description
The ESDA6V1xxM6 are monolithic arrays
designed to protect up to 4 or 5 lines against ESD
transients.
The device is ideal for applications where both
reduced print circuit board space and power
absorption capability are required.
February 2008
TM: Transil is a trademark of STMicroelectronics
Rev 4
1/11
www.st.com
11

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ESDA6V1M6 pdf
ESDA6V1M6, ESDA6V1-5M6
3 Package information
Package information
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Table 3. Package dimensions
D
N
Dimensions
Ref Millimeters
Inches
E Min Typ Max Min Typ Max
12
A
A1
12
1. ± 0.1 mm
2. ± 0.05 mm
e
L
k
b
A 0.50 0.55
A1 0.00 0.02
b 0.18 0.25
D(1) 1.45
E(1) 1.00
e(2) 0.50
k 0.20
L 0.30 0.35
0.60
0.05
0.30
0.40
0.020 0.022 0.024
0.000 0.001 0.002
0.007 0.010 0.012
0.057
0.039
0.020
0.008
0.012 0.014 0.016
www.DataSheet4U.com
Figure 13.
Footprint dimensions in mm [inches]
0.50
[0.020]
0.25
[0.010]
0.65
[0.026]
0.30 1.60
[0.012] [0.063]
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ESDA6V1M6 arduino
ESDA6V1M6, ESDA6V1-5M6
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
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document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
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Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2008 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
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