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PDF LP8725 Data sheet ( Hoja de datos )
| Número de pieza | LP8725 | |
| Descripción | Power Management Unit | |
| Fabricantes | National Semiconductor | |
| Logotipo |  |
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LP8725
PRODUCT BRIEF
December 1, 2009
Power Management Unit for Application/Multimedia
Processors and Sub-Systems
General Description
This device is a multi-function, programmable Power Man-
agement Unit (PMU), optimized for sub block power solutions.
This device integrates two highly efficient 600 mA step-down
DC/DC converters configurable up to 800 mA load with Dy-
namic Voltage Scaling (DVS) through an I2C, two low noise
analog LDOs, three digital LDOs for up to 300 mA load current
each, two Low Input Low Output (LILO) regulators and an
I2C-compatible serial interface to allow a host controller ac-
cess to the internal control registers. The device also features
programmable power-on sequencing. LDO regulators pro-
vide high PSRR and low noise ideally suited for supplying
power to both analog and digital loads.
The device can be configured either as a Sub_PMU for mod-
ules (for example, camera/multimedia modules) or as a
stand-alone PMU that powers the processor itself.
“Notice: This document is not a datasheet. For more in-
formation regarding this product or to order samples
please contact your local National Semiconductor sales
office or visit http://www.national.com/support/dir.html.
Features
■ Two High Efficiency Step-Down DC/DC Convertors,
IOUT = 600 mA, with a 4MHz switching frequency using
small 1µH inductors, with options up to 800 mA.
■ Three digital LDOs for up to 300 mA load current each
■ Two low-noise analog 300 mA LDOs
■ Two low-input low output regulators, IOUT = 300 mA
■ I2C-compatible interface for the controlling of internal
registers
■ Adjustable startup sequence through I2C or configuration
■ Thermal shutdown protection
Key Specifications
■ 190 mV typ. Dropout Voltage on digital LDOs @ 300 mA
■ 2% typ. Output Voltage Accuracy on digital and analog
LDOs
■ 10 µVrms Output Noise on analog LDOs
■ ±2% typ. Output Voltage Bucks up to 93% efficiency
■ 30-bump micro SMD package (0.5 mm pitch)
Applications
■ Multi-media Processors
■ Portable Handheld Products
www.DataSheet4U.com
© 2009 National Semiconductor Corporation 300980
www.national.com
1 page  
Physical Dimensions inches (millimeters) unless otherwise noted
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30-bump micro SMD Package
NS Package Number TLA30D1A
X1 = 2.568 mm ±0.030 mm
X2 = 2.974 mm ±0.030 mm
X3 = 0.600 mm ±0.075 mm
5 www.national.com
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| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet LP8725.PDF ] | |
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