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PDF ADV3000 Data sheet ( Hoja de datos )
| Número de pieza | ADV3000 | |
| Descripción | 3:1 HDMI/DVI Switch | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de ADV3000 (archivo pdf) en la parte inferior de esta página. Total 28 Páginas | ||
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3:1 HDMI/DVI Switch with Equalization
ADV3000
FEATURES
3 inputs, 1 output HDMI/DVI links
Enables HDMI 1.3-compliant receiver
4 TMDS channels per link
Supports 250 Mbps to 2.25 Gbps data rates
Supports 25 MHz to 225 MHz pixel clocks
Equalized inputs for operation with long HDMI cables
(20 meters at 2.25 Gbps)
Fully buffered unidirectional inputs/outputs
Globally switchable, 50 Ω on-chip terminations
Pre-emphasized outputs
Low added jitter
Single-supply operation (3.3 V)
4 auxiliary channels per link
Bidirectional unbuffered inputs/outputs
Flexible supply operation (3.3 V to 5 V)
HDCP standard compatible
Allows switching of DDC bus and 2 additional signals
Output disable feature
Reduced power dissipation
Removable output termination
Allows building of larger arrays
Two ADV3000s support HDMI/DVI dual-link
Standards compatible: HDMI receiver, HDCP, DVI
Serial (I2C slave) and parallel control interface
80-lead, 14 mm × 14 mm LQFP, Pb-free package
APPLICATIONS
Multiple input displays
Projectors
A/V receivers
Set-top boxes
Advanced television (HDTV) sets
SET-TOP BOX
HDTV SET
HDMI
RECEIVER
ADV3000
GAME
CONSOLE
DVD PLAYER
NameBrand
Power
DVD 01:18
Figure 1. Typical HDTV Application
FUNCTIONAL BLOCK DIAGRAM
PARALLEL
SERIAL
I2C_SDA
I2C_SCL
I2C_ADDR0
VTTI
22
CONFIG
INTERFACE
RESET
CONTROL
LOGIC
ADV3000
AVCC
DVCC
AMUXVCC
AVEE
DVEE
IP_A[3:0] +
IN_A[3:0]
IP_B[3:0]
+–
IN_B[3:0] –
IP_C[3:0] +
IN_C[3:0] –
4
4
4
4 EQ
4
4
SWITCH
CORE
PE
4
4
HIGH SPEED BUFFERED
VTTO
+ OP[3:0]
– ON[3:0]
VTTI
AUX_A[3:0]
AUX_B[3:0]
AUX_C[3:0]
4
4
4
SWITCH
CORE
4
LOW SPEED UNBUFFERED
BIDIRECTIONAL
Figure 2.
AUX_COM[3:0]
GENERAL DESCRIPTION
The ADV3000 is an HDMI™/DVI switch featuring equalized
TMDS inputs and pre-emphasized TMDS® outputs, ideal for
systems with long cable runs. Outputs can be set to a high
impedance state to reduce the power dissipation and/or to allow
the construction of larger arrays using the wire-OR technique.
The ADV3000 is provided in an 80-lead LQFP, Pb-free, surface-
mount package, specified to operate over the −40°C to +85°C
temperature range.
PRODUCT HIGHLIGHTS
1. Supports data rates up to 2.25 Gbps, enabling 1080p deep
color (12-bit color) HDMI formats, and greater than
UXGA (1600 × 1200) DVI resolutions.
2. Input cable equalizer enables use of long cables at the input
(more than 20 meters of 24 AWG cable at 2.25 Gbps).
3. Auxiliary switch routes a DDC bus and two additional signals
for a single-chip, HDMI 1.3 receive-compliant solution.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2007 Analog Devices, Inc. All rights reserved.
1 page  
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ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
AVCC to AVEE
DVCC to DVEE
DVEE to AVEE
VTTI
VTTO
AMUXVCC
Internal Power Dissipation
High Speed Input Voltage
High Speed Differential Input Voltage
Low Speed Input Voltage
I2C® and Parallel Logic Input Voltage
Storage Temperature Range
Operating Temperature Range
Junction Temperature
Rating
3.7 V
3.7 V
±0.3 V
AVCC + 0.6 V
AVCC + 0.6 V
5.5 V
2.2 W
AVCC − 1.4 V < VIN <
AVCC + 0.6 V
2.0 V
DVEE − 0.3 V < VIN <
AMUXVCC + 0.6 V
DVEE − 0.3 V < VIN <
DVCC + 0.6 V
−65°C to +125°C
−40°C to +85°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADV3000
THERMAL RESISTANCE
θJA is specified for the worst-case conditions: a device soldered
in a 4-layer JEDEC circuit board for surface-mount packages.
θJC is specified for no airflow.
Table 3. Thermal Resistance
Package Type
θJA
80-Lead LQFP
55
θJC Unit
17.8 °C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the ADV3000
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure. To ensure proper operation, it
is necessary to observe the maximum power rating as determined
by the coefficients in Table 3.
ESD CAUTION
Rev. 0 | Page 5 of 28
5 Page 
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ADV3000
TA = 27°C, AVCC = 3.3 V, VTTI = 3.3 V, VTTO = 3.3 V, DVCC = 3.3 V, AMUXVCC = 5 V, AVEE = 0 V, DVEE = 0 V, differential input
swing = 1000 mV, TMDS outputs terminated with external 50 Ω resistors to 3.3 V, pattern = PRBS 27 − 1, data rate = 2.25 Gbps, unless
otherwise noted.
50 50
40 40
30
DJ (p-p)
20
30
DJ (p-p)
20
10
RJ (rms)
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
DIFFERENTIAL INPUT SWING (V)
Figure 20. Jitter vs. Differential Input Swing
10
RJ (rms)
0
2.5 2.7 2.9 3.1 3.3 3.5
INPUT COMMON-MODE VOLTAGE (V)
Figure 23. Jitter vs. Input Common-Mode Voltage
3.7
50
45
40
35
30
25
20
15
10
5
0
–40
DJ (p-p)
RJ (rms)
–20 0
20 40 60
TEMPERATURE (°C)
Figure 21. Jitter vs. Temperature
80 100
120
115
110
105
100
95
90
85
80
–40
–20
0
20 40 60 80 100
TEMPERATURE (°C)
Figure 24. Differential Input Termination Resistance vs. Temperature
160
140
FALL TIME
120
RISE TIME
100
80
60
40
20
0
–40 –20
0
20 40 60 80
TEMPERATURE (°C)
Figure 22. Rise and Fall Time vs. Temperature
100
Rev. 0 | Page 11 of 28
11 Page | ||
| Páginas | Total 28 Páginas | |
| PDF Descargar | [ Datasheet ADV3000.PDF ] | |
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